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1. (WO2019061389) PRINTED CIRCUIT BOARD FOR PERFORMING RADIO FREQUENCY TESTING FOR TERMINAL, AND TERMINAL
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Pub. No.: WO/2019/061389 International Application No.: PCT/CN2017/104731
Publication Date: 04.04.2019 International Filing Date: 30.09.2017
IPC:
G01R 31/00 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Applicants:
深圳传音制造有限公司 SHENZHEN TRANSSION MANUFACTURE LIMITED [CN/CN]; 中国广东省深圳市 南山区粤海街道深圳湾科技生态园9栋B座16层01-07号房 Rooms 01-07, 14/F, Unit B, Building No.9 Shenzhen Bay Eco-Technology Park Yuehai Street, Nanshan District Shenzhen, Guangdong 518000, CN
Inventors:
张凤柳 ZHANG, Fengliu; CN
Agent:
上海波拓知识产权代理有限公司 PSHIP FIRM, LLC.; 中国上海市 静安区沪太路315弄2号19F Room 19F, No.2, 315 Lane Hutai Road, Jingan District Shanghai 200070, CN
Priority Data:
Title (EN) PRINTED CIRCUIT BOARD FOR PERFORMING RADIO FREQUENCY TESTING FOR TERMINAL, AND TERMINAL
(FR) CARTE DE CIRCUIT IMPRIMÉ POUR EFFECTUER UN TEST DE RADIOFRÉQUENCE POUR UN TERMINAL, ET TERMINAL
(ZH) 用于终端射频测试的印刷线路板及终端
Abstract:
(EN) A printed circuit board (100) for performing radio frequency testing for a terminal (400), and a terminal (400). The printed circuit board comprises an outer solder pad (120) and an inner solder pad (140). The inner solder pad (140) is provided in a hollow cavity (127) formed at the outer solder pad (120). The outer solder pad (120) is grounded. The inner solder pad (140) comprises a first pad section (143) and a second pad section (141). The first pad section (143) is electrically connected to an antenna (200). The second pad section (141) is electrically connected to a radio frequency circuit (300). The above arrangement can reduce costs relating to surface mounted devices and procurement costs.
(FR) Cette invention concerne une carte de circuit imprimé (100) pour effectuer un test de radiofréquence pour un terminal 400), et un terminal (400). La carte de circuit imprimé comprend un plot de soudure externe (120) et un plot de soudure interne (140). Le plot de soudure interne (140) est disposé dans une cavité creuse (127) formée dans le plot de soudure externe (120). Le plot de soudure externe (120) est mis à la terre. Le plot de soudure interne (140) comprend une première section de plot (143) et une seconde section de plot (141). La première section de plot (143) est électriquement connectée à une antenne (200). La seconde section de plot (141) est électriquement connectée à un circuit radiofréquence (300). L'agencement ci-dessus permet de réduire les coûts liés aux dispositifs montés en surface et les coûts d'approvisionnement.
(ZH) 一种用于终端(400)射频测试的印刷线路板(100)及终端(400),包括外圈焊盘(120)与内部焊盘(140),所述内部焊盘(140)设置在所述外圈焊盘(120)所形成的中空腔(127)内,所述外圈焊盘(120)接地,所述内部焊盘(140)包括第一焊盘(143)与第二焊盘(141),所述第一焊盘(143)与天线(200)电连接,所述第二焊盘(141)与射频电路(300)电连接,从而节省贴片成本,并能够节约采购成本。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)