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1. (WO2019061288) THERMALLY CONDUCTIVE COMPOSITION
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Pub. No.: WO/2019/061288 International Application No.: PCT/CN2017/104360
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
C09J 183/05 (2006.01) ,C09J 183/07 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
Applicants:
LIU, Zhihua [CN/CN]; CN (SC)
WEI, Peng [CN/CN]; CN (SC)
YAN, Hexiang [CN/CN]; CN (SC)
ZHAO, Yi [CN/CN]; CN (SC)
CHEN, Qi [CN/CN]; CN (SC)
ZHU, Junmin [CN/CN]; CN (SC)
DOW SILICONES CORPORATION [US/US]; 2200 West Salzburg Road P.O. Box 994 Midland, MI 48686-0994, US
Inventors:
LIU, Zhihua; CN
WEI, Peng; CN
YAN, Hexiang; CN
ZHAO, Yi; CN
CHEN, Qi; CN
ZHU, Junmin; CN
Agent:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road Shanghai 200233, CN
Priority Data:
Title (EN) THERMALLY CONDUCTIVE COMPOSITION
(FR) COMPOSITION THERMOCONDUCTRICE
Abstract:
(EN) Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.
(FR) L'invention concerne une composition, un matériau polymère durci formé à partir de ladite composition, un procédé de formation d'un matériau thermoconducteur sur un article et un article comprenant un matériau thermoconducteur. Ledit matériau thermoconducteur peut être formé sur un dispositif électronique, et peut être détaché dudit dispositif électronique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)