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1. (WO2019061166) SIX-SIDED SYSTEM-IN-PACKAGE ASSEMBLY
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Pub. No.: WO/2019/061166 International Application No.: PCT/CN2017/104029
Publication Date: 04.04.2019 International Filing Date: 28.09.2017
IPC:
H01L 25/00 (2006.01) ,H01L 23/13 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
13
characterised by the shape
Applicants:
XU, Zhijun [CN/CN]; CN (BZ)
LIU, Bin [CN/CN]; CN (BZ)
SHE, Yong [CN/CN]; CN (BZ)
DING, Zhicheng [CN/CN]; CN (BZ)
INTEL CORPORATION [US/US]; 2200 Mission College Blvd. Santa Clara, CA 95054, US
Inventors:
XU, Zhijun; CN
LIU, Bin; CN
SHE, Yong; CN
DING, Zhicheng; CN
Agent:
NTD PATENT AND TRADEMARK AGENCY LIMITED; 中国北京市 东城区北三环东路36号北京环球贸易中心C座10层 10th Floor, Tower C, Beijing Global Trade Center 36 North Third Ring Road East, Dongcheng District Beijing 100013, CN
Priority Data:
Title (EN) SIX-SIDED SYSTEM-IN-PACKAGE ASSEMBLY
(FR) ENSEMBLE SYSTÈME EN BOÎTIER À SIX CÔTÉS
Abstract:
(EN) An apparatus, comprising an IC package having a first surface, a second surface opposing the first surface, and at least four sidewalls extending orthogonally from a perimeter of the first surface to a perimeter of the second surface, and one or more electronic devices disposed on one or more of the at least four sidewalls.
(FR) L'invention concerne un appareil comprenant un boîtier de CI comportant une première surface, une seconde surface opposée à la première surface, et au moins quatre parois latérales s'étendant orthogonalement d'un périmètre de la première surface à un périmètre de la seconde surface, ainsi qu'au moins un dispositif électronique disposé sur au moins l'une des quatre parois latérales.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)