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1. (WO2019061067) FIRMWARE COMPONENT WITH SELF-DESCRIPTIVE DEPENDENCY INFORMATION
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Pub. No.: WO/2019/061067 International Application No.: PCT/CN2017/103642
Publication Date: 04.04.2019 International Filing Date: 27.09.2017
IPC:
G06F 9/445 (2018.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
9
Arrangements for programme control, e.g. control unit
06
using stored programme, i.e. using internal store of processing equipment to receive and retain programme
44
Arrangements for executing specific programmes
445
Programme loading or initiating
Applicants:
ZIMMER, Vincent [US/US]; US (BZ)
YAO, Jiewen [CN/CN]; CN (BZ)
INTEL CORPORATION [US/US]; 2200 Mission College Blvd. Santa Clara, California 95054, US
Inventors:
ZIMMER, Vincent; US
YAO, Jiewen; CN
Agent:
CHINA PATENT AGENT (H. K.) LTD.; 22/F., Great Eagle Center, 23 Harbour Road, Wanchai Hong Kong, CN
Priority Data:
Title (EN) FIRMWARE COMPONENT WITH SELF-DESCRIPTIVE DEPENDENCY INFORMATION
(FR) COMPOSANT DE MICROLOGICIEL AVEC INFORMATIONS DE DÉPENDANCE AUTO-DESCRIPTIVES
Abstract:
(EN) An embodiment of a semiconductor package apparatus may include technology to determine version information for a new firmware component, read dependency information corresponding to the firmware component, and determine if dependency is satisfied between the new firmware component and one or more other firmware components based on the version information and the dependency information of the new firmware component. Other embodiments are disclosed and claimed.
(FR) Un mode de réalisation de la présente invention concerne un appareil de boîtier de semi-conducteur qui peut comprendre une technologie pour déterminer des informations de version destinées à un nouveau composant de micrologiciel, lire des informations de dépendance correspondant au composant de micrologiciel, et déterminer si une dépendance est satisfaite entre le nouveau composant de micrologiciel et au moins un autre composant de micrologiciel basé sur les informations de version et les informations de dépendance du nouveau composant de micrologiciel. D'autres modes de réalisations sont également décrits et revendiqués.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)