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1. WO2019060267 - PRINTED CIRCUIT BOARD WITH HEAT SINK

Publication Number WO/2019/060267
Publication Date 28.03.2019
International Application No. PCT/US2018/051429
International Filing Date 18.09.2018
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
F28F 13/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13Arrangements for modifying heat transfer, e.g. increasing, decreasing
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
CPC
B33Y 80/00
BPERFORMING OPERATIONS; TRANSPORTING
33ADDITIVE MANUFACTURING TECHNOLOGY
YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
80Products made by additive manufacturing
F28F 2275/14
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
2275Fastening; Joining
14by using form fitting connection, e.g. with tongue and groove
F28F 3/022
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
022the means being wires or pins
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
H05K 1/021
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
021Components thermally connected to metal substrates or heat-sinks by insert mounting
H05K 1/181
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
181associated with surface mounted components
Applicants
  • AMAZON TECHNOLOGIES, INC. [US]/[US]
Inventors
  • MISCHE, William
Agents
  • PEREZ, Matthew G.
  • SCHLAMEUS, Brett J.
Priority Data
15/711,70721.09.2017US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PRINTED CIRCUIT BOARD WITH HEAT SINK
(FR) CARTE DE CIRCUITS IMPRIMÉS À DRAIN THERMIQUE
Abstract
(EN)
Printed circuit boards (PCBs) may include a heat sink (120) configured to draw heat from a surface-mounted component (128) through the PCB (110) toward a side (116) of the PCB opposite a side (114) having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors (500, 517,530, 531,537,545) that interface between the PCB and a heat sink, or possibly other components.
(FR)
L’invention concerne des cartes de circuits imprimés (PCB) pouvant comprendre un drain thermique (120) conçu pour extraire la chaleur depuis un composant monté en surface (128) vers un côté (116) de la PCB opposé au côté (114) présentant le composant monté en surface, en passant par la PCB (110). Les drains thermiques peuvent être des composants monobloc qui s'étendent au moins partiellement à travers la PCB. Selon certains modes de réalisation, la PCB peut comprendre des connecteurs (500, 517, 530, 531, 537, 545) qui servent d’interface entre la PCB et un drain thermique, ou éventuellement d'autres composants.
Also published as
JP2020514228
Latest bibliographic data on file with the International Bureau