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1. WO2019059832 - ULTRASONIC TRANSDUCER DEVICE, ACOUSTIC BIOMETRIC IMAGING SYSTEM AND MANUFACTURING METHOD

Publication Number WO/2019/059832
Publication Date 28.03.2019
International Application No. PCT/SE2018/050937
International Filing Date 17.09.2018
IPC
G06K 9/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
B06B 1/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
BGENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
1Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency
02making use of electrical energy
06operating with piezo-electric effect or with electrostriction
G06F 3/043 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
043using propagating acoustic waves
H01L 41/25 2013.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
25Assembling devices that include piezo-electric or electrostrictive parts
H04R 17/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
17Piezo-electric transducers; Electrostrictive transducers
CPC
B06B 1/0622
BPERFORMING OPERATIONS; TRANSPORTING
06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, ; e.g.; FOR PERFORMING MECHANICAL WORK IN GENERAL
1Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
02making use of electrical energy
06operating with piezo-electric effect or with electrostriction
0607using multiple elements
0622on one surface
G06K 9/0002
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
0002by non-optical methods, e.g. by ultrasonic or capacitive sensing
G06K 9/22
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
20Image acquisition
22using hand-held instruments
H01L 41/0475
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
04of piezo-electric or electrostrictive devices
047Electrodes ; or electrical connection arrangements
0475Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
H01L 41/0986
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08Piezo-electric or electrostrictive devices
09with electrical input and mechanical output ; , e.g. actuators, vibrators
0986using longitudinal or thickness displacement only, e.g. d33 or d31 type devices
H01L 41/311
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
31Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base
311Mounting of piezo-electric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
Applicants
  • FINGERPRINT CARDS AB [SE]/[SE]
Inventors
  • LUNDAHL, Karl
  • NILSSON, Hanna
  • GRIP, Martin
Agents
  • KRANSELL & WENNBORG KB
Priority Data
1751184-122.09.2017SE
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ULTRASONIC TRANSDUCER DEVICE, ACOUSTIC BIOMETRIC IMAGING SYSTEM AND MANUFACTURING METHOD
(FR) DISPOSITIF TRANSDUCTEUR ULTRASONORE, SYSTÈME D'IMAGERIE BIOMÉTRIQUE ACOUSTIQUE ET PROCÉDÉ DE FABRICATION
Abstract
(EN)
A method of manufacturing ultrasonic transducer devices, comprising fabricating an ultrasonic transducer panel;and dividing the ultrasonic transducer panel into ultrasonic transducer devices. Fabricating the ultrasonic transducer panel includes: providing a first carrier; arranging a plurality of piezoelectric elements spaced apart on the first carrier; applying adielectric material on the plurality of piezoelectric elements to embed each piezoelectric element in the plurality of piezoelectric elements in the dielectric material, thereby forming a piezoelectric element device layer on the first carrier; thinning the piezoelectric element device layer, resulting in an exposed first side of each piezoelectric element in the plurality of piezoelectric elements; forming a first electrode layer on the piezoelectric element device layer, the first electrode layer including a first transducer electrode on the exposed first side of each piezoelectric element in the piezoelectric element device layer; and separating the piezoelectric element device layer from the first carrier.
(FR)
L'invention concerne un procédé de fabrication de dispositifs transducteurs ultrasonores, comprenant la fabrication d'un panneau transducteur ultrasonore ; et la division du panneau transducteur ultrasonore en dispositifs transducteurs ultrasonores. La fabrication du panneau de transducteur ultrasonore comprend : la fourniture d'un premier support ; l'agencement d'une pluralité d'éléments piézoélectriques espacés sur le premier support ; l'application d'un matériau piézoélectrique sur la pluralité d'éléments piézoélectriques pour incorporer chaque élément piézoélectrique dans la pluralité d'éléments piézoélectriques dans le matériau diélectrique, formant ainsi une couche de dispositif d'élément piézoélectrique sur le premier support ; l'amincissement de la couche de dispositif d'élément piézoélectrique, ce qui permet d'obtenir un premier côté exposé de chaque élément piézoélectrique dans la pluralité d'éléments piézoélectriques ; la formation d'une première couche d'électrode sur la couche de dispositif d'élément piézoélectrique, la première couche d'électrode comprenant une première électrode de transducteur sur le premier côté exposé de chaque élément piézoélectrique dans la couche de dispositif d'élément piézoélectrique ; et la séparation de la couche de dispositif d'élément piézoélectrique du premier support.
Also published as
Latest bibliographic data on file with the International Bureau