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1. WO2019059164 - LIGHT EMITTING ELEMENT-ACCOMMODATING MEMBER, ARRAY MEMBER, AND LIGHT EMITTING DEVICE

Publication Number WO/2019/059164
Publication Date 28.03.2019
International Application No. PCT/JP2018/034407
International Filing Date 18.09.2018
IPC
H01S 5/022 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
CPC
H01S 5/02208
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02208characterised by the shape of the housings
H01S 5/0222
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02218Material of the housings; Filling of the housings
0222Gas-filled housings
H01S 5/02257
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0225Out-coupling of light
02257using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
H01S 5/02326
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
023Mount members, e.g. sub-mount members
02325Mechanically integrated components on mount members or optical micro-benches
02326Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
H01S 5/02469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
H01S 5/02476
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 東 登志文 HIGASHI,Toshifumi
  • 山元 泉太郎 YAMAMOTO,Sentaro
  • 古久保 洋二 FURUKUBO,Youji
  • 山口 貴史 YAMAGUCHI,Takafumi
Priority Data
2017-17906119.09.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT EMITTING ELEMENT-ACCOMMODATING MEMBER, ARRAY MEMBER, AND LIGHT EMITTING DEVICE
(FR) ÉLÉMENT DE RÉCEPTION D’ÉLÉMENT ÉLECTROLUMINESCENT, ÉLÉMENT DE RÉSEAU ET DISPOSITIF ÉLECTROLUMINESCENT
(JA) 発光素子収納用部材、アレイ部材および発光装置
Abstract
(EN)
Provided is a light emitting element-mounting/accommodating member 1 provided with: a bottom base substrate 7 having a mounting part 12 for mounting a light emitting element 3 on a first surface 7a; and a frame member 9 which is configured by side walls 9a, 9b, 9c, 9d standing erect from the first surface 7a and is disposed so as to surround the mounting part 12, wherein the side walls 9a, 9b, 9c, 9d of the frame member 9 are disposed so as to surround the mounting part 12, and the frame member 9 has an opening section 15 that passes through the side walls 9a, 9b, 9c, 9d. The opening section 15 has, as inner edges 15A, a first side 15a disposed, along the first surface 7a, at a position close to the bottom base substrate 7, and a second side 15c disposed, along the first surface 7a, at a position away from the bottom base substrate 7, the second side 15c being longer than the first side 15a. An array member 100 is formed by connecting a plurality of light emitting element-accommodating members 101A. A light emitting device A is provided with light emitting elements 3 disposed on the mounting parts 12 of the light emitting element-accommodating members 101A.
(FR)
L'invention concerne un élément de montage/réception d'élément électroluminescent 1 comprenant : un substrat de base inférieur 7 ayant une partie de montage 12 pour monter un élément électroluminescent 3 sur une première surface 7a ; et un élément de cadre 9 qui est configuré par des parois latérales 9a, 9b, 9c, 9d debout à partir de la première surface 7a et est disposé de façon à entourer la partie de montage 12, les parois latérales 9a, 9b, 9c, 9d de l'élément de cadre 9 étant disposées de manière à entourer la partie de montage 12, et l'élément de cadre 9 a une section d'ouverture 15 qui passe à travers les parois latérales 9a, 9b, 9c, 9d. La section d'ouverture 15 comporte, en tant que bords internes 15A, un premier côté 15a disposé, le long de la première surface 7a, à une position proche du substrat de base inférieur 7, et un second côté disposé 15c disposé, le long de la première surface 7a, à une position éloignée du substrat de base inférieur 7, le second côté 15c étant plus long que le premier côté 15a. Un élément de réseau 100 est formé par connexion d'une pluralité d'éléments de réception d'élément électroluminescent 101A. Un dispositif électroluminescent A comprend des éléments électroluminescents 3 disposés sur les parties de montage 12 des éléments de réception d'élément électroluminescent 101A.
(JA)
発光素子搭載用収納用部材1は、第1面7aに発光素子3を搭載するための搭載部12を有する底部基材7と、第1面7aに立設する側壁9a、9b、9c、9dにより構成され、搭載部12を囲むように配置されている枠部材9とを備え、枠部材9は、側壁9a、9b、9c、9dが搭載部12を囲むように配置されており、枠部材9は、側壁9a、9b、9c、9dを貫通している開口部15を有しており、開口部15は、第1面7aに沿い、底部基材7に近い位置に配置された第1辺15aと、第1面7aに沿い、底部基材7から遠い位置に配置された第2辺15cとを内縁15Aとして有し、第2辺15cは第1辺15aよりも長い。アレイ部材100は、上記の発光素子収納用部材101Aが複数個連結されたものである。発光装置Aは、上記の発光素子収納用部材101Aの搭載部12上に発光素子3を備えている。
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