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1. (WO2019059043) VALVE DEVICE, FLOW ADJUSTMENT METHOD, FLUID CONTROL DEVICE, FLOW CONTROL METHOD, SEMICONDUCTOR MANUFACTURING DEVICE, AND SEMICONDUCTOR MANUFACTURING METHOD
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Pub. No.: WO/2019/059043 International Application No.: PCT/JP2018/033596
Publication Date: 28.03.2019 International Filing Date: 11.09.2018
IPC:
F16K 31/02 (2006.01) ,F16K 31/122 (2006.01) ,F16K 37/00 (2006.01) ,H01L 21/02 (2006.01) ,H01L 21/31 (2006.01) ,F16K 7/12 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
K
VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
31
Operating means; Releasing devices
02
electric; magnetic
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
K
VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
31
Operating means; Releasing devices
12
actuated by fluid
122
the fluid acting on a piston
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
K
VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
37
Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31
to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
K
VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
7
Diaphragm cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage
12
with flat, dished, or bowl-shaped diaphragm
Applicants:
株式会社フジキン FUJIKIN INCORPORATED [JP/JP]; 大阪府大阪市西区立売堀2丁目3番2号 3-2, Itachibori 2-chome, Nishi-ku, Osaka-city Osaka 5500012, JP
Inventors:
近藤 研太 KONDO Kenta; JP
吉田 俊英 YOSHIDA Toshihide; JP
相川 献治 AIKAWA Kenji; JP
佐藤 秀信 SATO Hidenobu; JP
中田 知宏 NAKATA Tomohiro; JP
篠原 努 SHINOHARA Tsutomu; JP
滝本 昌彦 TAKIMOTO Masahiko; JP
Agent:
藤本 健司 FUJIMOTO Kenji; JP
Priority Data:
2017-18363825.09.2017JP
Title (EN) VALVE DEVICE, FLOW ADJUSTMENT METHOD, FLUID CONTROL DEVICE, FLOW CONTROL METHOD, SEMICONDUCTOR MANUFACTURING DEVICE, AND SEMICONDUCTOR MANUFACTURING METHOD
(FR) DISPOSITIF DE SOUPAPE, PROCÉDÉ DE RÉGLAGE D'ÉCOULEMENT, DISPOSITIF DE COMMANDE DE FLUIDE, PROCÉDÉ DE RÉGULATION D'ÉCOULEMENT, DISPOSITIF DE FABRICATION DE SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE SEMI-CONDUCTEUR
(JA) バルブ装置、流量調整方法、流体制御装置、流量制御方法、半導体製造装置および半導体製造方法
Abstract:
(EN) A valve device is provided which can precisely adjust flow variation over time and with aging, without using external sensors. This valve device is provided with an adjustment actuator (100) which utilizes a piezoelectric element for adjusting the position of an operation member positioned in an open position. A drive circuit (200) of the adjustment actuator (100) comprises a detection unit (210) which detects an electric signal relating to the amount of strain generated in the piezoelectric element, and a control unit (210) which, on the basis of the electric signal relating to the amount of strain in the piezoelectric element, controls the adjustment actuator (100) such that the degree of opening of the flow path by a valve body is a target opening amount.
(FR) Dispositif de soupape qui peut régler avec précision une variation d'écoulement dans le temps et avec le vieillissement, sans utiliser de capteurs externes. Ce dispositif de soupape est pourvu d'un actionneur de réglage (100) qui utilise un élément piézoélectrique pour régler la position d'un élément d'actionnement positionné dans une position ouverte. Un circuit d'entraînement (200) de l'actionneur de réglage (100) comprend une unité de détection (210) qui détecte un signal électrique relatif à la quantité de contrainte générée dans l'élément piézoélectrique, et une unité de commande (210) qui, sur la base du signal électrique relatif à la quantité de contrainte dans l'élément piézoélectrique, commande l'actionneur de réglage (100) de telle sorte que le degré d'ouverture du chemin d'écoulement par un corps de soupape est une quantité d'ouverture cible.
(JA) 外部センサを用いることなく、経時、経年等による流量変動を精密に調整可能なバルブ装置を提供する。 開位置に位置付けられた操作部材の位置を調整するための圧電素子を利用した調整用アクチュエータ(100)を有し、調整用アクチュエータ(100)の駆動回路(200)は、圧電素子に生じるひずみ量に係わる電気信号を検出する検出部(210)と、圧電素子のひずみ量に係わる電気信号に基づいて、弁体による流路の開度が目標開度になるように調整用アクチュエータ(100)を制御する制御部(210)とを有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)