Processing

Please wait...

Settings

Settings

Goto Application

1. WO2019058721 - TITANIUM SPUTTERING TARGET, PRODUCTION METHOD THEREFOR, AND METHOD FOR PRODUCING TITANIUM-CONTAINING THIN FILM

Publication Number WO/2019/058721
Publication Date 28.03.2019
International Application No. PCT/JP2018/026595
International Filing Date 13.07.2018
IPC
C23C 14/34 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
C22F 1/18 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
16of other metals or alloys based thereon
18High-melting or refractory metals or alloys based thereon
C22C 14/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
14Alloys based on titanium
C22F 1/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
CPC
C22C 14/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
14Alloys based on titanium
C22F 1/183
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
16of other metals or alloys based thereon
18High-melting or refractory metals or alloys based thereon
183of titanium or alloys based thereon
C23C 14/3414
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3407Cathode assembly for sputtering apparatus, e.g. Target
3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
H01J 37/3426
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3411Constructional aspects of the reactor
3414Targets
3426Material
Applicants
  • JX金属株式会社 JX NIPPON MINING & METALS CORPORATION [JP]/[JP]
Inventors
  • 村田 周平 MURATA,Shuhei
  • 正能 大起 SHONO,Daiki
Agents
  • アクシス国際特許業務法人 AXIS PATENT INTERNATIONAL
Priority Data
2017-18169421.09.2017JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) TITANIUM SPUTTERING TARGET, PRODUCTION METHOD THEREFOR, AND METHOD FOR PRODUCING TITANIUM-CONTAINING THIN FILM
(FR) CIBLE DE PULVÉRISATION EN TITANE, SON PROCÉDÉ DE PRODUCTION ET PROCÉDÉ DE PRODUCTION DE COUCHE MINCE CONTENANT DU TITANE
(JA) スパッタリング用チタンターゲット及びその製造方法、並びにチタン含有薄膜の製造方法
Abstract
(EN) Provided is a titanium sputtering target having a recrystallized structure with an average crystal grain size of 1 µm or less. Also provided is a production method for a titanium sputtering target comprising: a step for large strain processing of cut titanium ingots to obtain processed sheets; a step for cold rolling said processed sheets at a reduction of at least 30%; and a step for heat-treating said rolled sheets at a temperature of 320°C or less.
(FR) L'invention concerne une cible de pulvérisation en titane comprenant une structure recristallisée présentant une taille moyenne de grain cristallin inférieure ou égale à 1 µm. L'invention concerne également un procédé de production d'une cible de pulvérisation en titane comprenant : une étape de traitement à contrainte élevée de lingots en titane coupés pour obtenir des tôles traitées; une étape de laminage à froid desdites tôles traitées jusqu'à une réduction d'au moins 30 %; et une étape de traitement thermique desdites tôles laminées à une température inférieure ou égale à 320 °C.
(JA) 平均結晶粒径が1μm以下の再結晶組織を有するスパッタリング用チタンターゲットを提供する。また、切断したチタンインゴットを大ひずみ加工して加工板を得る工程と、前記加工板を30%以上の圧延率で冷間圧延して圧延板を得る工程と、前記圧延板を320℃以下の温度で熱処理する工程とを含むスパッタリング用チタンターゲットの製造方法を提供する。
Latest bibliographic data on file with the International Bureau