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1. WO2019055962 - METHODS AND APPARATUS FOR CONTROLLING DELIVERY OF CROSS FLOWING AND IMPINGING ELECTROLYTE DURING ELECTROPLATING

Publication Number WO/2019/055962
Publication Date 21.03.2019
International Application No. PCT/US2018/051447
International Filing Date 18.09.2018
IPC
C25D 17/00 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
C25D 5/08 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
08Electroplating with moving electrolyte, e.g. jet electroplating
C25D 17/06 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
06Suspending or supporting devices for articles to be coated
C25D 21/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
12Process control or regulation
C25D 17/02 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
02Tanks; Installations therefor
C25D 7/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
CPC
C25D 17/001
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
001Apparatus specially adapted for plating wafers, e.g. semiconductors, solar cells
C25D 17/002
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
002Cell separation, e.g. membranes, diaphragms
C25D 17/008
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
008Current insulating devices
C25D 21/12
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
21Processes for servicing or operating cells for electrolytic coating
12Process control or regulation
C25D 5/08
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
08Electroplating with moving electrolyte ; , characterised by electrolyte flow; , e.g. jet electroplating
C25D 7/12
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
7Electroplating characterised by the article coated
12Semiconductors
Applicants
  • LAM RESEARCH CORPORATION [US]/[US]
Inventors
  • BANIK, Stephen J. II
  • BERKE, Aaron
  • BUCKALEW, Bryan L.
  • RASH, Robert
Agents
  • KESICH, Amanda M.
  • WEAVER, Jeffrey K.
  • AUSTIN, James E.
  • VILLENEUVE, Joseph M.
  • SAMPSON, Roger S.
  • BERGIN, Denise S.
  • GRIFFITH, John F.
  • SCHOLZ, Christian D.
Priority Data
15/707,80518.09.2017US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHODS AND APPARATUS FOR CONTROLLING DELIVERY OF CROSS FLOWING AND IMPINGING ELECTROLYTE DURING ELECTROPLATING
(FR) PROCÉDÉS ET APPAREIL DE COMMANDE DE DISTRIBUTION D'ÉLECTROLYTE INCIDENT ET À ÉCOULEMENT TRANSVERSAL PENDANT UN DÉPÔT ÉLECTROLYTIQUE
Abstract
(EN)
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (above the ionically resistive element) and an ionically resistive element manifold (below the ionically resistive element). Electrolyte is delivered to the cross flow manifold, where it shears over the surface of the substrate, and to the ionically resistive element manifold, where it passes through through-holes in the ionically resistive element to impinge upon the substrate as it enters the cross flow manifold. In certain embodiments, the flow of electrolyte into the cross flow manifold (e.g., through a side inlet) and the flow of electrolyte into the ionically resistive element manifold are actively controlled, e.g., using a three-way valve. In these or other cases, the ionically resistive element may include electrolyte jets.
(FR)
Divers modes de réalisation de la présente invention concernent des procédés et un appareil de dépôt électrolytique de matériau sur un substrat semi-conducteur. L'appareil comprend un élément à résistance ionique qui sépare la chambre de placage en un collecteur à écoulement transversal (au-dessus de l'élément à résistance ionique) et un collecteur d'élément à résistance ionique (au-dessous de l'élément à résistance ionique). L'électrolyte est distribué au collecteur à écoulement transversal, où il se cisaille sur la surface du substrat, et au collecteur d'élément à résistance ionique, où il passe par des trous traversants dans l'élément à résistance ionique pour être incident sur le substrat lorsqu'il entre dans le collecteur à écoulement transversal. Dans certains modes de réalisation, l'écoulement d'électrolyte dans le collecteur à écoulement transversal (par exemple, par une entrée latérale) et l'écoulement d'électrolyte dans le collecteur d'élément à résistance ionique sont commandés activement, par exemple à l'aide d'une vanne trois voies. Dans ces cas ou dans d'autres cas, l'élément à résistance ionique peut comprendre des jets d'électrolyte.
Also published as
JP2020515673
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