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1. WO2019055435 - VERTICAL SWITCHED FILTER BANK

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Publication Number WO/2019/055435
Publication Date 21.03.2019
International Application No. PCT/US2018/050529
International Filing Date 11.09.2018
IPC
H05K 1/14 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
H01L 23/498 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H01L 23/538 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
H05K 1/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
CPC
H01L 2223/6627
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6605High-frequency electrical connections
6627Waveguides, e.g. microstrip line, strip line, coplanar line
H01L 2223/6683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6683for monolithic microwave integrated circuit [MMIC]
H01L 2224/16227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16227the bump connector connecting to a bond pad of the item
H01L 2225/1047
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
10the devices having separate containers
1005the devices being of a type provided for in group H01L27/00
1011the containers being in a stacked arrangement
1047Details of electrical connections between containers
H01L 2225/107
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
10the devices having separate containers
1005the devices being of a type provided for in group H01L27/00
1011the containers being in a stacked arrangement
1047Details of electrical connections between containers
107Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
H01L 23/5387
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5387Flexible insulating substrates
Applicants
  • KNOWLES CAZENOVIA, INC. [US]/[US]
Inventors
  • BATES, David
Agents
  • PUA, Meng H.
  • BELDEN, Brett P.
Priority Data
62/557,63212.09.2017US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) VERTICAL SWITCHED FILTER BANK
(FR) BANC DE FILTRES À COMMUTATION VERTICALE
front page image
Abstract
(EN) A microwave or radio frequency (RF) device (100) includes a first substrate (105) having a top surface, the top surface having a ground terminal (122) and a signal terminal (126) and a second substrate (102) disposed over the top surface of the first substrate, the second substrate having a through-hole (120). A conductive material (104) covers sidewalls (196) of the through-hole, at least a portion of the first surface (192) and at least a portion of the second surface (194) at rim edges of the through-hole, the conductive material on the first surface is in electrical contact with the ground terminal. A microwave component (112) is disposed within the through-hole and on the top surface of the first substrate, the microwave component having a ground terminal (128) in electrical contact with the ground terminal of the first substrate, and a signal terminal (130) in electrical contact with the signal terminal. A conductive cover (132) is mounted on the second substrate covering the through-hole, the cover including a conductive surface in electrical contact with the conductive material covering the second surface of the second substrate.
(FR) La présente invention concerne un dispositif hyperfréquence ou radiofréquence (RF) (100) qui comprend un premier substrat (105) ayant une surface supérieure, la surface supérieure ayant une borne de masse (122) et une borne de signal (126) et un deuxième substrat (102) disposé sur la surface supérieure du premier substrat, le deuxième substrat ayant un trou traversant (120). Un matériau conducteur (104) recouvre les parois latérales (196) du trou traversant, au moins une partie de la première surface (192) et au moins une partie de la deuxième surface (194) au niveau des bords de rebord du trou traversant, le matériau conducteur sur la première surface est en contact électrique avec la borne de masse. Un composant hyperfréquence (112) est disposé à l'intérieur du trou traversant et sur la surface supérieure du premier substrat, le composant hyperfréquence comportant une borne de masse (128) en contact électrique avec la borne de masse du premier substrat, et une borne de signal (130) en contact électrique avec la borne de signal. Un couvercle conducteur (132) est monté sur le deuxième substrat recouvrant le trou traversant, le couvercle comprenant une surface conductrice en contact électrique avec le matériau conducteur recouvrant la deuxième surface du deuxième substrat.
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