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1. WO2019054291 - ETCHING LIQUID FOR ACTIVE METAL BRAZING MATERIALS AND METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD USING SAME

Publication Number WO/2019/054291
Publication Date 21.03.2019
International Application No. PCT/JP2018/033197
International Filing Date 07.09.2018
IPC
C23F 1/30 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES; INHIBITING CORROSION OF METALLIC MATERIAL; INHIBITING INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25247
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
30for etching other metallic material
B23K 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
C23F 1/18 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES; INHIBITING CORROSION OF METALLIC MATERIAL; INHIBITING INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25247
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
18for etching copper or alloys thereof
H05K 3/06 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
CPC
B23K 1/00
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
C23F 1/18
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
18for etching copper or alloys thereof
C23F 1/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
30for etching other metallic material
H05K 3/06
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applicants
  • 株式会社 東芝 KABUSHIKI KAISHA TOSHIBA [JP]/[JP]
  • 東芝マテリアル株式会社 TOSHIBA MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 加藤 寛正 KATO, Hiromasa
  • 平林 英明 HIRABAYASHI, Hideaki
  • 川島 史行 KAWASHIMA, Fumiyuki
  • 佐々木 亮人 SASAKI, Akito
Agents
  • 日向寺 雅彦 HYUGAJI, Masahiko
  • 小崎 純一 KOZAKI, Junichi
  • 市川 浩 ICHIKAWA, Hiroshi
Priority Data
2017-17478812.09.2017JP
2018-01068025.01.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ETCHING LIQUID FOR ACTIVE METAL BRAZING MATERIALS AND METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD USING SAME
(FR) LIQUIDE DE GRAVURE POUR MATÉRIAUX DE BRASAGE DE MÉTAL ACTIF ET PROCÉDÉ DE PRODUCTION DE CARTES DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE L'UTILISANT
(JA) 活性金属ろう材用エッチング液およびそれを用いたセラミックス回路基板の製造方法
Abstract
(EN)
An etching liquid for active metal brazing materials, which is used for the purpose of etching an active metal brazing material layer that contains Ag, Cu and an active metal. This etching liquid for active metal brazing materials contains ammonium fluoride, hydrofluoboric acid, and one or two substances selected from among hydrogen peroxide and ammonium peroxodisulfate.
(FR)
Cette invention concerne un liquide de gravure pour matériaux de brasage de métal actif, qui est utilisé pour graver une couche de matériau de brasage de métal actif qui contient du Ag, Cu et un métal actif. Le liquide de gravure pour matériaux de brasage de métal actif contient selon l'invention du fluorure d'ammonium, de l'acide hydrofluoborique et une ou deux substances choisies parmi le peroxyde d'hydrogène et le peroxodisulfate d'ammonium.
(JA)
Ag、Cuおよび活性金属を含有した活性金属ろう材層をエッチングするための活性金属ろう材用エッチング液において、活性金属ろう材用エッチング液は、フッ化アンモニウムと、硼弗化水素酸と、過酸化水素およびペルオキソ二硫酸アンモニウムから選ばれる1種または2種と、を含有する。
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