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1. WO2019053802 - METHOD FOR MANUFACTURING DISPLAY DEVICE

Publication Number WO/2019/053802
Publication Date 21.03.2019
International Application No. PCT/JP2017/033021
International Filing Date 13.09.2017
IPC
G09F 9/00 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
CPC
G09F 9/00
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 2251/5338
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
53Structure
5338Flexible OLED
H01L 2251/566
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2251Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
50Organic light emitting devices
56Processes specially adapted for the manufacture or treatment of OLED
566Division of substrate, e.g. for manufacturing of OLED dsiplays
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 51/003
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
003using a temporary substrate
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 近藤 伸裕 KONDOH, Nobuhiro
Agents
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING DISPLAY DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIF D'AFFICHAGE
(JA) 表示デバイスの製造方法
Abstract
(EN)
A method for manufacturing a display device includes forming a gap (21) by taking a part of a resin film (11) in a region (41) between a separation start position (31) in the resin film (11) and a display element (12). After the display element (12) and the gap (21) are formed, the resin film (11) is mechanically separated starting from the separation start position (31).
(FR)
L'invention concerne un procédé permettant de fabriquer un dispositif d'affichage, ledit procédé consistant à former un espace (21) en prenant une partie d'un film de résine (11) dans une zone (41) entre une position de début de séparation (31) dans le film de résine (11) et un élément d'affichage (12). Après que l'élément d'affichage (12) et l'espace (21) ont été formés, le film de résine (11) est séparé mécaniquement de la position de début de séparation (31).
(JA)
樹脂膜(11)の一部が欠落された欠落部(21)を、樹脂膜(11)における剥離開始位置(31)と表示素子(12)との間にある領域(41)に形成する。表示素子(12)および欠落部(21)が形成された後、樹脂膜(11)を剥離開始位置(31)から機械的に剥離する。
Also published as
Latest bibliographic data on file with the International Bureau