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1. WO2019052237 - ASSEMBLY METHOD AND DEVICE FOR CIRCUIT STRUCTURAL MEMBER, AND CIRCUIT STRUCTURAL MEMBER

Publication Number WO/2019/052237
Publication Date 21.03.2019
International Application No. PCT/CN2018/090368
International Filing Date 08.06.2018
IPC
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/34 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/42
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
H05K 1/0203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
H05K 3/0005
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0005for designing circuits by computer
Applicants
  • 中兴通讯股份有限公司 ZTE CORPORATION [CN]/[CN]
Inventors
  • 黄竹邻 HUANG, Zhulin
Agents
  • 北京天昊联合知识产权代理有限公司 TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS
Priority Data
201710823223.113.09.2017CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ASSEMBLY METHOD AND DEVICE FOR CIRCUIT STRUCTURAL MEMBER, AND CIRCUIT STRUCTURAL MEMBER
(FR) PROCÉDÉ ET DISPOSITIF D'ASSEMBLAGE POUR ÉLÉMENT STRUCTURAL DE CIRCUIT, ET ÉLÉMENT STRUCTURAL DE CIRCUIT
(ZH) 一种电路结构件的装配方法、设备及电路结构件
Abstract
(EN)
Provided are an assembly method and device for a circuit structural member, and a circuit structural member. The method comprises: measuring a depth and path of a channel between at least one chip and a printed circuit board (PCB), the at least one chip is arranged on the PCB; according to the depth and path of the channel between the at least one chip and the PCB and a predetermined heat dissipation parameter, determining a thickness and path of a heat dissipation reinforcement material, so as to configure a dispensing parameter and path; according to the dispensing parameter and path, applying the heat dissipation reinforcement material in the channel between the at least one chip and the PCB; and heating the heat dissipation reinforcement material to a first predetermined temperature, so that the heat dissipation reinforcement material permeates into the chip and the PCB.
(FR)
L'invention concerne un procédé et un dispositif d'assemblage pour un élément structural de circuit, et un élément structural de circuit. Le procédé comprend : la mesure d'une profondeur et d'un trajet d'un canal entre au moins une puce et une carte de circuit imprimé (PCB), la ou les puces étant disposées sur la carte de circuit imprimé; en fonction de la profondeur et du trajet du canal entre la ou les puces et la carte de circuit imprimé et d'un paramètre de dissipation de chaleur prédéterminé, la détermination d'une épaisseur et d'un trajet d'un matériau de renforcement de dissipation de chaleur, de manière à configurer un paramètre et un trajet de distribution; en fonction du paramètre et du trajet de distribution, l'application du matériau de renforcement de dissipation de chaleur dans le canal entre la ou les puces et la carte de circuit imprimé; et le chauffage du matériau de renforcement de dissipation de chaleur à une première température prédéterminée, de sorte que le matériau de renforcement de dissipation de chaleur s'infiltre dans la puce et la carte de circuit imprimé.
(ZH)
本公开提供了一种电路结构件的装配方法、设备及电路结构件。该方法包括:测量至少一个芯片与PCB之间沟道的深度和路径,所述至少一个芯片设置在印刷电路板PCB上;根据所述至少一个芯片与PCB之间沟道的深度和路径、以及预定的散热参数,确定散热加固材料的厚度和路径,以配置点胶参数和路径;按照所述点胶参数和路径在所述至少一个芯片与PCB之间的沟道内涂覆所述散热加固材料;以及将所述散热加固材料加热至第一预定温度,使得所述散热加固材料渗入所述芯片和PCB。
Also published as
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