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1. (WO2019050887) SURFACE MOUNT MICROWAVE DEVICE AND ASSEMBLY
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Pub. No.: WO/2019/050887 International Application No.: PCT/US2018/049458
Publication Date: 14.03.2019 International Filing Date: 05.09.2018
IPC:
H01P 1/38 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
1
Auxiliary devices
32
Non-reciprocal transmission devices
38
Circulators
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
MOLEX, LLC [US/US]; 2222 Wellington Court Lisle, Illinois 60532, US
Inventors:
TAYKOV, Andrey; US
VOLOBUEV, Nikolay; US
Agent:
JACOBS, Jeffrey K.; US
Priority Data:
62/554,74106.09.2017US
Title (EN) SURFACE MOUNT MICROWAVE DEVICE AND ASSEMBLY
(FR) DISPOSITIF HYPERFRÉQUENCE À MONTAGE EN SURFACE ET ASSEMBLAGE
Abstract:
(EN) A microwave device (10) configured for surface mounting on a circuit board includes first and second conductive members adjacent a mounting surface of the device. The first and second conductive members are devoid of solder pads. An assembly includes a microwave device and a circuit board on which the microwave device is mounted. The circuit board includes signal conductors that are devoid of solder pads.
(FR) L'invention concerne un dispositif hyperfréquence (10) configuré pour un montage en surface sur une carte de circuit imprimé comprenant des premier et second éléments conducteurs adjacents à une surface de montage du dispositif. Les premier et second éléments conducteurs sont dépourvus de plots de soudure. Un assemblage comprend un dispositif hyperfréquence et une carte de circuit imprimé sur laquelle le dispositif hyperfréquence est monté. La carte de circuit imprimé comprend des conducteurs de signaux qui sont dépourvus de plots de soudure.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)