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1. (WO2019050806) SILICONE-FREE THERMAL GEL
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Pub. No.: WO/2019/050806 International Application No.: PCT/US2018/049218
Publication Date: 14.03.2019 International Filing Date: 31.08.2018
IPC:
C08J 3/075 (2006.01) ,C08L 71/02 (2006.01) ,C08L 61/28 (2006.01) ,C08G 65/48 (2006.01) ,C08K 5/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3
Processes of treating or compounding macromolecular substances
02
Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
03
in aqueous media
075
Macromolecular gels
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71
Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
02
Polyalkylene oxides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61
Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
20
Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
26
of aldehydes with heterocyclic compounds
28
with melamine
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
65
Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
34
from hydroxy compounds or their metallic derivatives
48
Polymers modified by chemical after-treatment
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
Applicants:
HONEYWELL INTERNATIONAL INC. [US/US]; Patent Services M/S 4D3 115 Tabor Road P. O. Box 377 Morris Plains, New Jersey 07950, US
Inventors:
ZHANG, Liqiang; US
DUAN, Huifeng; US
PAN, Rongwei; US
ZHANG, Qi; US
LIU, Ya Qun; US
KANG, Haigang; US
Agent:
SZUCH, Colleen; US
Priority Data:
16/105,45620.08.2018US
62/555,95408.09.2017US
Title (EN) SILICONE-FREE THERMAL GEL
(FR) GEL THERMIQUE SANS SILICONE
Abstract:
(EN) The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.
(FR) La présente invention concerne un gel sans silicone utile pour transférer de la chaleur à partir de dispositifs électroniques générant de la chaleur, tels que des puces d'ordinateur, vers des structures de dissipation de chaleur, telles que des dissipateurs et des radiateurs thermiques. Le matériau d'interface thermique comprend un polyol de polyéther, un agent de réticulation, un agent de couplage, un antioxydant, un catalyseur et au moins une charge thermoconductrice.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)