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1. (WO2019050602) METAL LAYERING CONSTRUCTION IN FLEX/RIGID-FLEX PRINTED CIRCUITS
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Pub. No.: WO/2019/050602 International Application No.: PCT/US2018/038866
Publication Date: 14.03.2019 International Filing Date: 22.06.2018
IPC:
H05K 1/02 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; One Microsoft Way Redmond, Washington 98052-6399, US
Inventors:
LESTER, Jonathan Bernard; US
GRAYDON, Bhret Robert; US
MICKELSON, Matthew David; US
RYAN, Lauren Akemi Hamamoto Donegan; US
Agent:
MINHAS, Sandip S.; US
CHEN, Wei-Chen Nicholas; US
HINOJOSA, Brianna L.; US
HOLMES, Danielle J.; US
SWAIN, Cassandra T.; US
WONG, Thomas S.; US
CHOI, Daniel; US
HWANG, William C.; US
WIGHT, Stephen A.; US
CHATTERJEE, Aaron C.; US
JARDINE, John S.; US
GOLDSMITH, Micah P.; US
Priority Data:
15/696,99506.09.2017US
Title (EN) METAL LAYERING CONSTRUCTION IN FLEX/RIGID-FLEX PRINTED CIRCUITS
(FR) CONSTRUCTION DE COUCHES MÉTALLIQUES DANS DES CIRCUITS IMPRIMÉS SOUPLES/RIGIDES-SOUPLES
Abstract:
(EN) A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.
(FR) L'invention concerne une carte de circuit imprimé. La carte de circuit imprimé comprend une région souple. La région souple comprend une première couche de cuivre, une première couche diélectrique, une seconde couche de cuivre, une couche adhésive et une première couche métallique, dans l'ordre indiqué. La première couche métallique comprend un film métallique ayant une résistance à la traction supérieure à celle des première et seconde couches de cuivre et supérieure à celle de la couche diélectrique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)