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1. (WO2019050525) FLEXIBLE WIRING FOR LOW TEMPERATURE APPLICATIONS
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Pub. No.: WO/2019/050525 International Application No.: PCT/US2017/050504
Publication Date: 14.03.2019 International Filing Date: 07.09.2017
IPC:
G06N 99/00 (2010.01) ,H01H 45/10 (2006.01) ,H01H 50/10 (2006.01) ,H01L 23/49 (2006.01) ,H01L 23/498 (2006.01) ,H01L 39/02 (2006.01) ,H05K 7/02 (2006.01) ,H01L 23/538 (2006.01) ,H01L 23/552 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
N
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
99
Subject matter not provided for in other groups of this subclass
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
H
ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
45
Details of relays
10
Electromagnetic or electrostatic shielding
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
H
ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
50
Details of electromagnetic relays
10
Electromagnetic or electrostatic shielding
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
49
wire-like
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39
Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
52
Arrangements for conducting electric current within the device in operation from one component to another
538
the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
552
Protection against radiation, e.g. light
Applicants:
GOOGLE LLC [US/US]; 1600 Amphitheatre Parkway Mountain View, California 94043, US
Inventors:
MARTINIS, John; US
Agent:
VALENTINO, Joseph; US
FRANZ, Paul E.; US
Priority Data:
Title (EN) FLEXIBLE WIRING FOR LOW TEMPERATURE APPLICATIONS
(FR) CÂBLAGE FLEXIBLE POUR APPLICATIONS À BASSE TEMPÉRATURE
Abstract:
(EN) The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.
(FR) La présente invention peut être mise en œuvre dans des dispositifs, tels qu'un câblage flexible, qui comprennent : un substrat flexible allongé; de multiples traces électroconductrices disposées en réseau sur un premier côté du substrat flexible allongé; et une couche de protection électromagnétique sur un second côté du substrat flexible allongé, le second côté étant opposé au premier côté, dans lequel le substrat flexible allongé comprend une région de pliage entre une première trace électroniquement conductrice et une seconde trace électriquement conductrice de telle sorte que la couche de protection électromagnétique assure une protection électromagnétique entre la première trace électroniquement conductrice et la seconde trace électriquement conductrice.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)