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1. (WO2019050388) LED PRECISION ASSEMBLY METHOD
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Pub. No.: WO/2019/050388 International Application No.: PCT/MY2017/050053
Publication Date: 14.03.2019 International Filing Date: 08.09.2017
IPC:
H01L 33/48 (2010.01) ,H01L 33/00 (2010.01) ,H01L 33/20 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
Applicants:
WU, Weiping [CN/MY]; MY
BEAUJEU, Charly [MY/MY]; MY
JABIL INC. [US/US]; 10560 Dr. Martin Luther King Jr. Street N. St. Petersburg Florida, 33716, US
Inventors:
WU, Weiping; MY
BEAUJEU, Charly; MY
Agent:
SINGH, Jasdeep; MY
Priority Data:
Title (EN) LED PRECISION ASSEMBLY METHOD
(FR) PROCÉDÉ D'ASSEMBLAGE DE PRÉCISION DE LED
Abstract:
(EN) System and methods to enable integration of electronic components to form LED assembly with a high accuracy (0.1mm or better) and high process capability (Cpk of 1.67 or higher) for realizing precision electro-mechanical device. The system and methods use through holes that connect a printed circuit board to a housing as fiducial marks and LED emitter center as a reference point for alignment in order to improve the efficacy and accuracy of assembling of the LED assembly. The through holes are drilled by using laser drilling or milling machine, Use of adhesive to anchor the LED component down prior to reflow process i.e. to avoid self alignment characteristic of component on solder paste during reflow process.
(FR) L'invention concerne un système et des procédés pour permettre l'intégration de composants électroniques en vue de former un assemblage de LED avec une précision élevée (0,1 mm ou mieux) et une capacité de traitement élevée (Cpk de 1,67 ou plus) pour réaliser un dispositif électromécanique de précision. Le système et les procédés utilisent des trous traversants qui relient une carte à circuit imprimé à un boîtier en tant que repères de plaque et le centre d'un émetteur à LED en tant que point de référence pour l'alignement afin d'améliorer l'efficacité et la précision d'assemblage de l'assemblage de LED. Les trous traversants sont percés en utilisant le perçage au laser ou une fraiseuse. Un adhésif est utilisé pour ancrer le composant LED vers le bas avant le processus de refusion, c'est-à-dire pour éviter une caractéristique d'auto-alignement du composant sur la pâte à souder pendant le processus de refusion.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)