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1. (WO2019050377) DRY PLATING APPARATUS AND DRY PLATING METHOD
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Pub. No.: WO/2019/050377 International Application No.: PCT/KR2018/010617
Publication Date: 14.03.2019 International Filing Date: 11.09.2018
IPC:
C23C 14/24 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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characterised by the process of coating
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Vacuum evaporation
Applicants:
주식회사 포스코 POSCO [KR/KR]; 경상북도 포항시 남구 동해안로 6261 (괴동동) (Goedong-dong) 6261, Donghaean-ro, Nam-gu Pohang-si, Gyeongsangbuk-do 37859, KR
Inventors:
김구화 KIM, Goo-Hwa; KR
Agent:
특허법인 씨엔에스 C&S PATENT AND LAW OFFICE; 서울시 강남구 언주로30길 13, 대림아크로텔 7층 7th Floor, Daelim Acrotel 13, Eonju-ro 30-gil Gangnam-gu, Seoul 06292, KR
Priority Data:
10-2017-011611911.09.2017KR
Title (EN) DRY PLATING APPARATUS AND DRY PLATING METHOD
(FR) APPAREIL DE PLACAGE À SEC ET PROCÉDÉ DE PLACAGE À SEC
(KO) 건식 도금 장치 및 건식 도금 방법
Abstract:
(EN) The present invention provides a dry plating apparatus which can perform continuous plating by continued smooth supply of solid raw materials. An embodiment provides a dry plating apparatus comprising: a vapor chamber configured such that vapor is sprayed onto a material to be plated within the vapor chamber; an evaporation heating unit disposed outside an evaporation region, in which molten raw materials are placed, within the vapor chamber; a solid raw material supply pipe extending from a solid raw material supply unit to the evaporation region and extending through at least a part of the vapor chamber, so as to supply raw materials to the evaporation region; the solid raw material supply unit connected to the solid raw material supply pipe; and a solid raw material heating unit for heating such solid raw materials that are located outside the evaporation region in the solid raw material supply pipe.
(FR) La présente invention concerne un appareil de placage à sec, qui peut effectuer un placage continu par une alimentation homogène continue en matières premières solides. Selon un mode de réalisation, l'appareil de placage à sec comprend : une chambre à vapeur, conçue de sorte que de la vapeur soit pulvérisée sur une matière devant être plaquée au sein de la chambre à vapeur; une unité de chauffage par évaporation disposée à l'extérieur d'une région d'évaporation, dans laquelle sont placées des matières premières fondues, au sein de la chambre à vapeur; un tuyau d'alimentation en matières premières solides, s'étendant d'une unité d'alimentation en matières premières solides à la région d'évaporation et s'étendant à travers au moins une partie de la chambre à vapeur, de façon à alimenter la région d'évaporation en matières premières; l'unité d'alimentation en matières premières solides, reliée au tuyau d'alimentation en matières premières solides; et une unité de chauffage de matières premières solides, destinée à chauffer de telles matières premières solides qui sont situées à l'extérieur de la région d'évaporation dans le tuyau d'alimentation en matières premières solides.
(KO) 본 발명은 고체 원료를 원활하게 지속적으로 공급하여 연속 도금이 가능한 건식 도금 장치를 제공하는 것으로, 일실시예로 내부의 증기를 피도금재로 분사되도록 구성된 증기 챔버; 증기 챔버 내부의 용융 원료가 위치하는 증발 영역의 외측에 배치된 증발 가열부; 상기 증발 영역으로 원료를 공급하도록 고체 원료 공급부로부터 상기 증발 영역으로 연장하며, 상기 증기 챔버의 적어도 일부를 통과하는 고체 원료 공급관; 상기 고체 원료 공급관에 연결된 고체 원료 공급부; 및 상기 고체 원료 공급관 내의 고체 원료 중 증발 영역을 기준으로 바깥쪽 고체 원료를 가열하는 고체 원료 가열부;를 포함하는 건식 도금 장치를 제공한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)