Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019050333) ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/050333 International Application No.: PCT/KR2018/010501
Publication Date: 14.03.2019 International Filing Date: 07.09.2018
IPC:
H05K 9/00 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
SAMSUNG ELECTRONICS CO., LTD. [KR/KR]; 129, Samsung-ro, Yeongtong-gu Suwon-si Gyeonggi-do 16677, KR
Inventors:
MUN, Il-ju; KR
KUK, Keon; KR
KIM, Kyong-il; KR
JUNG, Jin-woo; KR
Agent:
KIM, Tae-hun; KR
JEONG, Hong-sik; KR
Priority Data:
10-2017-011535708.09.2017KR
Title (EN) ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE
(FR) STRUCTURE DE PROTECTION CONTRE LES INTERFÉRENCES ÉLECTROMAGNÉTIQUES
Abstract:
(EN) An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.
(FR) L'invention concerne une structure de protection contre les interférences électromagnétiques. La structure de protection contre les interférences électromagnétiques comprend un tampon de protection et un boîtier de protection. Le tampon de protection est configuré pour entourer au moins un élément de circuit monté sur une carte de circuit imprimé et pour être mis à la terre sur un tampon de mise à la terre formé sur une carte de circuit imprimé. Le boîtier de protection peut comprendre une plaque supérieure et une paroi latérale s'étendant à partir de la plaque supérieure et partiellement incorporée dans le tampon de protection.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)