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1. (WO2019050011) ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET
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Pub. No.: WO/2019/050011 International Application No.: PCT/JP2018/033287
Publication Date: 14.03.2019 International Filing Date: 07.09.2018
IPC:
C09J 7/35 (2018.01) ,C09J 4/00 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01) ,H01B 1/20 (2006.01) ,H01L 21/60 (2006.01)
[IPC code unknown for C09J 7/35]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
森尻 智樹 MORIJIRI Tomoki; JP
大當 友美子 OTO Yumiko; JP
工藤 直 KUDOU Sunao; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
2017-17394111.09.2017JP
Title (EN) ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET
(FR) FILM ADHÉSIF POUR CONNEXION DE CIRCUITS ET PROCÉDÉ DE FABRICATION ASSOCIÉ, PROCÉDÉ DE FABRICATION D'UNE STRUCTURE DE CONNEXION DE CIRCUITS ET ENSEMBLE CONTENANT POUR FILM ADHÉSIF
(JA) 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
Abstract:
(EN) This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the melt viscosity of the first adhesive layer 2 at the temperature at which the second adhesive layer 3 exhibits the lowest melt viscosity, to said lowest melt viscosity of the second adhesive layer 3 is greater than or equal to 10.
(FR) L’invention concerne un film adhésif (1) pour connexion de circuits, lequel comporte une première couche (2) d'adhésif contenant des particules conductrices (4) et une deuxième couche (3) d’adhésif stratifiée sur la première couche (2) d'adhésif. Le rapport entre la viscosité à l'état fondu de la première couche (2) d’adhésif à une température indiquant le plus bas degré de viscosité à l'état fondu de la deuxième couche (3) d'adhésif, et la viscosité à l'état fondu de la deuxième couche (3) d’adhésif est supérieur ou égal à 10.
(JA) 導電粒子4を含有する第1の接着剤層2と、該第1の接着剤層2上に積層された、第2の接着剤層3と、を備え、第2の接着剤層3の最低溶融粘度に対する、第2の接着剤層3が最低溶融粘度を示す温度における第1の接着剤層2の溶融粘度の比が10以上である、回路接続用接着剤フィルム1。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)