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1. WO2019050011 - ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET

Publication Number WO/2019/050011
Publication Date 14.03.2019
International Application No. PCT/JP2018/033287
International Filing Date 07.09.2018
IPC
C09J 7/35 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
35Heat-activated
C09J 4/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 9/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 11/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
H01B 1/20 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
CPC
C09J 11/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
04inorganic
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 2301/208
C09J 2301/312
C09J 4/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Applicants
  • 日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP]
Inventors
  • 森尻 智樹 MORIJIRI Tomoki
  • 大當 友美子 OTO Yumiko
  • 工藤 直 KUDOU Sunao
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 清水 義憲 SHIMIZU Yoshinori
  • 平野 裕之 HIRANO Hiroyuki
Priority Data
2017-17394111.09.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE FILM FOR CIRCUIT CONNECTIONS AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM HOUSING SET
(FR) FILM ADHÉSIF POUR CONNEXION DE CIRCUITS ET PROCÉDÉ DE FABRICATION ASSOCIÉ, PROCÉDÉ DE FABRICATION D'UNE STRUCTURE DE CONNEXION DE CIRCUITS ET ENSEMBLE CONTENANT POUR FILM ADHÉSIF
(JA) 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
Abstract
(EN)
This adhesive film 1 for circuit connections is provided with a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on said first adhesive layer 2, wherein the ratio of the melt viscosity of the first adhesive layer 2 at the temperature at which the second adhesive layer 3 exhibits the lowest melt viscosity, to said lowest melt viscosity of the second adhesive layer 3 is greater than or equal to 10.
(FR)
L’invention concerne un film adhésif (1) pour connexion de circuits, lequel comporte une première couche (2) d'adhésif contenant des particules conductrices (4) et une deuxième couche (3) d’adhésif stratifiée sur la première couche (2) d'adhésif. Le rapport entre la viscosité à l'état fondu de la première couche (2) d’adhésif à une température indiquant le plus bas degré de viscosité à l'état fondu de la deuxième couche (3) d'adhésif, et la viscosité à l'état fondu de la deuxième couche (3) d’adhésif est supérieur ou égal à 10.
(JA)
導電粒子4を含有する第1の接着剤層2と、該第1の接着剤層2上に積層された、第2の接着剤層3と、を備え、第2の接着剤層3の最低溶融粘度に対する、第2の接着剤層3が最低溶融粘度を示す温度における第1の接着剤層2の溶融粘度の比が10以上である、回路接続用接着剤フィルム1。
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