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1. (WO2019050008) SILICA-CONTAINING INSULATING COMPOSITION
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Pub. No.: WO/2019/050008 International Application No.: PCT/JP2018/033283
Publication Date: 14.03.2019 International Filing Date: 07.09.2018
IPC:
H01B 3/00 (2006.01) ,C01B 33/142 (2006.01) ,C01B 33/146 (2006.01) ,C01B 33/149 (2006.01) ,C01B 33/18 (2006.01) ,C08J 3/20 (2006.01) ,C08K 3/36 (2006.01) ,C08K 9/06 (2006.01) ,C08L 101/00 (2006.01) ,H01B 3/30 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3
Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
33
Silicon; Compounds thereof
113
Silicon oxides; Hydrates thereof
12
Silica; Hydrates thereof, e.g. lepidoic silicic acid
14
Colloidal silica, e.g. dispersions, gels, sols
141
Preparation of hydrosols or aqueous dispersions
142
by acidic treatment of silicates
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
33
Silicon; Compounds thereof
113
Silicon oxides; Hydrates thereof
12
Silica; Hydrates thereof, e.g. lepidoic silicic acid
14
Colloidal silica, e.g. dispersions, gels, sols
146
After-treatment of sols
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
33
Silicon; Compounds thereof
113
Silicon oxides; Hydrates thereof
12
Silica; Hydrates thereof, e.g. lepidoic silicic acid
14
Colloidal silica, e.g. dispersions, gels, sols
146
After-treatment of sols
149
Coating
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
33
Silicon; Compounds thereof
113
Silicon oxides; Hydrates thereof
12
Silica; Hydrates thereof, e.g. lepidoic silicic acid
18
Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3
Processes of treating or compounding macromolecular substances
20
Compounding polymers with additives, e.g. colouring
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9
Use of pretreated ingredients
04
Ingredients treated with organic substances
06
with silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3
Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18
mainly consisting of organic substances
30
plastics; resins; waxes
Applicants:
日産化学株式会社 NISSAN CHEMICAL CORPORATION [JP/JP]; 東京都中央区日本橋二丁目5番1号 5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo 1036119, JP
Inventors:
末村 尚彦 SUEMURA, Naohiko; JP
杉澤 雅敏 SUGISAWA, Masatoshi; JP
Agent:
特許業務法人はなぶさ特許商標事務所 HANABUSA PATENT & TRADEMARK OFFICE; 東京都千代田区神田駿河台3丁目2番地 新御茶ノ水アーバントリニティ Shin-Ochanomizu Urban Trinity, 2, Kandasurugadai 3-chome, Chiyoda-ku, Tokyo 1010062, JP
Priority Data:
2017-17196707.09.2017JP
Title (EN) SILICA-CONTAINING INSULATING COMPOSITION
(FR) COMPOSITION ISOLANTE CONTENANT DE LA SILICE
(JA) シリカ含有絶縁性組成物
Abstract:
(EN) [Problem] To provide an insulating composition that contains silica particles, a resin, and a curing agent, and that suppresses and reduces elution of Na ion from the silica particles and exhibits little timewise change in insulating properties. [Solution] The insulating composition contains silica particles (A), a resin (B), and a curing agent (C). The silica particles (A) are silica particles for which, after heating an aqueous solution with an SiO2 concentration of 3.8 mass% for 20 hours at 121℃, the amount of Na ion elution is not more than 40 ppm/SiO2. The silica particles (A) are silica particles that in particular have an amount of Na ion elution post-heating of 5 to 38 ppm/SiO2, contain multivalent metal M in multivalent metal oxide in a proportion of 0.001 to 0.02 as the M/Si molar ratio, have an Na2O/SiO2 mass ratio in the particles of 700 to 1300 ppm, have a 0.1 to 1.5 nm layer with an Na2O/SiO2 mass ratio of 10 to 400 ppm formed on the particle surface, and have an average particle diameter of 5 to 40 nm.
(FR) Le problème décrit par la présente invention est de fournir une composition isolante contenant des particules de silice, une résine et un agent de durcissement, et supprimant et réduisant l'élution d'ions Na à partir des particules de silice et présentant peu de changement dans le temps des propriétés isolantes. La solution selon l'invention porte sur une composition isolante qui contient des particules de silice (A), une résine (B) et un agent de durcissement (C). Les particules de silice (A) sont des particules de silice pour lesquelles, après chauffage d'une solution aqueuse ayant une concentration de SiO2 de 3,8 % en masse pendant 20 heures à 121 °C, la quantité d'élution d'ions Na n'est pas supérieure à 40 ppm/SiO2. Les particules de silice (A) sont des particules de silice qui ont en particulier une quantité de post-chauffage par élution d'ions Na de 5 à 38 ppm/SiO2, contiennent un métal multivalent M dans un oxyde métallique multivalent dans une proportion de 0,001 à 0,02 en tant que rapport molaire M/Si, ont un rapport massique Na2O/SiO2 dans les particules de 700 à 1300 ppm, ont une couche de 0,1 à 1,5 nm avec un rapport massique Na2O/SiO2 de 10 à 400 ppm formé sur la surface de particule, et ont un diamètre moyen de particule de 5 à 40 nm.
(JA) 【課題】シリカ粒子と樹脂と硬化剤とを含み、シリカ粒子からのNaイオンの溶出を抑制・低減し、絶縁性の経時変化が少ない絶縁性組成物を提供する。 【解決手段】シリカ粒子(A)と樹脂(B)と硬化剤(C)とを含む絶縁性組成物であって、前記シリカ粒子(A)は、SiO濃度3.8質量%の該水溶液を121℃、20時間加熱したときの溶出Naイオン量が40ppm/SiO以下であるシリカ粒子である。シリカ粒子(A)は特に加熱後の溶出Naイオン量が5~38ppm/SiOであるシリカ粒子であり、また、多価金属酸化物の多価金属MをM/Siモル比として0.001~0.02の割合にて含み、粒子中のNaO/SiO質量比が700~1300ppmであるシリカ粒子であって、前記粒子表面に、NaO/SiO質量比が10~400ppmである0.1~1.5nmの層が形成された、5~40nmの平均粒子径を有するシリカ粒子である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)