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1. (WO2019050006) ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE TAPE-CONTAINING SET
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Pub. No.: WO/2019/050006 International Application No.: PCT/JP2018/033262
Publication Date: 14.03.2019 International Filing Date: 07.09.2018
IPC:
H05K 1/14 (2006.01) ,C09J 7/10 (2018.01) ,C09J 7/30 (2018.01) ,C09J 11/00 (2006.01) ,C09J 11/06 (2006.01) ,C09J 201/00 (2006.01) ,H01B 1/20 (2006.01) ,H01B 13/00 (2006.01) ,H01R 11/01 (2006.01) ,H01R 43/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
[IPC code unknown for C09J 7/10][IPC code unknown for C09J 7/30]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01
characterised by the form or arrangement of the conductive interconnection between their connecting locations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
大當 友美子 OTO Yumiko; JP
伊澤 弘行 IZAWA Hiroyuki; JP
工藤 直 KUDOU Sunao; JP
森尻 智樹 MORIJIRI Tomoki; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
2017-17393911.09.2017JP
Title (EN) ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE TAPE-CONTAINING SET
(FR) FILM ADHÉSIF DESTINÉ À UNE CONNEXION DE CIRCUIT ET SON PROCÉDÉ DE FABRICATION, PROCÉDÉ DE FABRICATION DE STRUCTURE DE CONNEXION DE CIRCUIT ET ENSEMBLE CONTENANT UN RUBAN ADHÉSIF
(JA) 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
Abstract:
(EN) An adhesive film 1 for circuit connection, said adhesive film 1 being provided with a first adhesive layer 2 and a second adhesive layer 3 that is laminated on the first adhesive layer 2, wherein: the first adhesive layer 2 is formed of a cured product of a photo-curable composition; the second adhesive layer 3 is formed of a heat-curable composition; and the photo-curable composition comprises a polymerizable compound, conductive particles 4 and a photopolymerization initiator having at least one structure selected from the group consisting of a structure represented by formula (I), a structure represented by formula (II) and a structure represented by formula (III).
(FR) La présente invention concerne un film adhésif 1 destiné à une connexion de circuit, ledit film adhésif 1 étant pourvu d'une première couche adhésive 2 et d'une seconde couche adhésive 3 qui est stratifiée sur la première couche adhésive 2, la première couche adhésive 2 étant formée d'un produit durci d'une composition photodurcissable ; la seconde couche adhésive 3 est formée d'une composition thermodurcissable ; et la composition photodurcissable consiste en un composé polymérisable, en des particules conductrices 4 et en un initiateur de photopolymérisation présentant au moins une structure choisie parmi le groupe constitué d'une structure représentée par la formule (I), d'une structure représentée par la formule (II) et d'une structure représentée par la formule (III).
(JA) 第1の接着剤層2と、該第1の接着剤層2上に積層された第2の接着剤層3と、を備え、第1の接着剤層2は光硬化性組成物の硬化物からなり、第2の接着剤層3は熱硬化性組成物からなり、光硬化性組成物は、重合性化合物と、導電粒子4と、下記式(I)で示される構造、下記式(II)で示される構造及び下記式(III)で示される構造からなる群より選択される少なくとも一種の構造を有する光重合開始剤と、を含有する、回路接続用接着剤フィルム1。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)