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1. (WO2019050005) ADHESIVE FILM HOUSING SET, AND MANUFACTURING METHOD THEREOF
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Pub. No.: WO/2019/050005 International Application No.: PCT/JP2018/033260
Publication Date: 14.03.2019 International Filing Date: 07.09.2018
IPC:
C09J 7/35 (2018.01) ,B65D 85/67 (2006.01) ,C09J 4/00 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01) ,H01B 1/20 (2006.01) ,H01R 11/01 (2006.01) ,H05K 3/32 (2006.01)
[IPC code unknown for C09J 7/35]
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
D
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
85
Containers, packaging elements or packages, specially adapted for particular articles or materials
67
for other web or tape-like material
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01
characterised by the form or arrangement of the conductive interconnection between their connecting locations
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
森尻 智樹 MORIJIRI Tomoki; JP
大當 友美子 OTO Yumiko; JP
飯村 忠光 IIMURA Tadamitsu; JP
越川 康之 KOSHIKAWA Yasuyuki; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
2017-17394611.09.2017JP
Title (EN) ADHESIVE FILM HOUSING SET, AND MANUFACTURING METHOD THEREOF
(FR) ENSEMBLE CONTENANT POUR FILM ADHÉSIF ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) 接着剤フィルム収容セット及びその製造方法
Abstract:
(EN) This adhesive film housing set 1A is provided with an adhesive film 10 for circuit connections and a housing member 30A housing said adhesive film 10. The adhesive film 10 is provided with a first adhesive layer 12 and a second adhesive layer 13 laminated on the first adhesive layer 12. The first adhesive layer 12 is formed from the cured product of a photocurable composition containing conductive particles 14 and a photopolymerization initiator, and the second adhesive layer 13 is formed from a heat curable composition. The housing member 30A has a viewing area 32A which makes the inside of the housing member 30A visible to the outside, and the transmittance of 365 nm wavelength light in the viewing area 32A is less than or equal to 10%.
(FR) L’invention concerne un ensemble (1A) contenant pour film adhésif comportant: un film adhésif (10) pour connexion de circuit, et un contenant (30A) destiné à recevoir le film adhésif (10). Le film adhésif (10) comporte une première couche (12) d’adhésif et une deuxième couche (13) d'adhésif stratifiée sur la première couche (12) d’adhésif. La première couche (12) d’adhésif est constituée de particules conductrices (14) et d’une composition photodurcissable contenant un photoamorceur, et la deuxième couche (13) d’adhésif est constituée d'une composition thermodurcissable. Le contenant (30A) possède une partie visible (32A) au moyen de laquelle on peut voir l’intérieur du contenant (30A) depuis l'extérieur du contenant (30A), la transmittance de la partie visible (32A) pour une lumière d’une longueur d'onde de 365nm étant inférieure ou égale à 10%.
(JA) 回路接続用接着剤フィルム10と、該接着剤フィルム10を収容する収容部材30Aと、を備え、接着剤フィルム10は、第1の接着剤層12と、該第1の接着剤層12上に積層された第2の接着剤層13と、を備え、第1の接着剤層12は、導電粒子14及び光重合開始剤を含有する光硬化性組成物の硬化物からなり、第2の接着剤層13は、熱硬化性組成物からなり、収容部材30Aは、該収容部材30Aの内部を外部から視認可能とする視認部32Aを有し、視認部32Aにおける波長365nmの光の透過率は10%以下である、接着剤フィルム収容セット1A。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)