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1. WO2019050001 - METHOD FRO DETERMINING ANGLE OF PROBE, HIGH-FREQUENCY CHARACTERISTIC INSPECTING DEVICE, PROGRAM AND STORAGE MEDIUM

Publication Number WO/2019/050001
Publication Date 14.03.2019
International Application No. PCT/JP2018/033254
International Filing Date 07.09.2018
IPC
G01R 31/28 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 31/26 2014.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
G01R 27/06 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
27Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
04in circuits having distributed constants
06Measuring reflection coefficients; Measuring standing-wave ratio
G01R 35/00 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
35Testing or calibrating of apparatus covered by the other groups of this subclass
CPC
G01R 1/06772
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06772High frequency probes
G01R 27/06
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
27Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
04in circuits having distributed constants ; , e.g. having very long conductors or involving high frequencies
06Measuring reflection coefficients; Measuring standing-wave ratio
G01R 31/26
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
G01R 31/28
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 35/00
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
35Testing or calibrating of apparatus covered by the preceding groups
Applicants
  • 国立研究開発法人産業技術総合研究所 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY [JP]/[JP]
Inventors
  • 坂巻 亮 SAKAMAKI, Ryo
  • 堀部 雅弘 HORIBE, Masahiro
Agents
  • 青木 篤 AOKI, Atsushi
  • 三橋 真二 MITSUHASHI, Shinji
  • 南山 知広 MINAMIYAMA, Chihiro
  • 伊坪 公一 ITSUBO, Koichi
  • 宮本 哲夫 MIYAMOTO, Tetsuo
Priority Data
2017-17192707.09.2017JP
2018-01434931.01.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FRO DETERMINING ANGLE OF PROBE, HIGH-FREQUENCY CHARACTERISTIC INSPECTING DEVICE, PROGRAM AND STORAGE MEDIUM
(FR) PROCÉDÉ DE DÉTERMINATION D'ANGLE DE SONDE, DISPOSITIF D'INSPECTION DE CARACTÉRISTIQUE HAUTE FRÉQUENCE, PROGRAMME ET SUPPORT D'ENREGISTREMENT
(JA) プローブの角度を決定する方法、高周波特性検査装置、プログラム及び記憶媒体
Abstract
(EN)
This method includes, while varying a probe angle relative to a flat electrical conductor surface of a substrate which includes said electrical conductor surface and which is placed on a placement surface of a stage of a high-frequency characteristic inspecting device, to thereby vary a state of contact between a tip end of a signal terminal and a tip end of a ground terminal on the one hand and the electrical conductor surface on the other hand: at different probe angles, obtaining an S parameter by outputting a high-frequency signal from the signal terminal to the electrical conductor surface and receiving a reflected signal using the probe; and, on the basis of a plurality of S parameters, determining a reference probe angle at which the electrical conductor surface is parallel to a reference line formed by joining the tip end of the signal terminal and the tip end of the ground terminal.
(FR)
L'invention concerne un procédé qui comprend les étapes consistant à, tout en faisant varier un angle de sonde par rapport à une surface conductrice électrique plate d'un substrat qui comprend ladite surface conductrice électrique et qui est placé sur une surface de placement d'un étage d'un dispositif d'inspection de caractéristique haute fréquence, pour ainsi faire varier un état de contact entre une extrémité de pointe d'une borne de signal et une extrémité de pointe d'une borne de masse d'une part et la surface conductrice électrique d'autre part : selon différents angles de sonde, obtenir un paramètre S par émission d'un signal haute fréquence à partir de la borne de signal vers la surface conductrice électrique et recevoir un signal réfléchi à l'aide de la sonde ; et, sur la base d'une pluralité de paramètres S, déterminer un angle de sonde de référence auquel la surface conductrice électrique est parallèle à une ligne de référence formée en joignant l'extrémité de pointe de la borne de signal et l'extrémité de pointe de la borne de masse.
(JA)
方法は、高周波特性検査装置のステージの載置面上に載置された平坦な導電体面を有する基板の導電体面と、プローブ角度を変化させることにより、シグナル端子の先端及びグランド端子の先端と導電体面との接触状態を変化させながら、異なるプローブ角度において、シグナル端子から高周波信号を導電体面に出力し且つプローブを用いて反射信号を受信してSパラメータを求めることと、複数のSパラメータに基づいて、シグナル端子の先端とグランド端子の先端とを結んで形成される基準線と導電体面とが平行となる基準プローブ角度を決定すること、を含む。
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