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1. (WO2019049917) FLUX
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/049917 International Application No.: PCT/JP2018/032958
Publication Date: 14.03.2019 International Filing Date: 06.09.2018
IPC:
B23K 35/363 (2006.01) ,B23K 35/26 (2006.01) ,C22C 13/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
36
Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
362
Selection of compositions of fluxes
363
for soldering or brazing
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
26
with the principal constituent melting at less than 400C
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
13
Alloys based on tin
Applicants:
千住金属工業株式会社 SENJU METAL INDUSTRY CO., LTD. [JP/JP]; 東京都足立区千住橋戸町23番地 23, Senju-Hashido-cho, Adachi-ku, Tokyo 1208555, JP
Inventors:
川中子 知久 KAWANAGO Tomohisa; JP
平岡 美幸 HIRAOKA Miyuki; JP
西▲崎▼ 貴洋 NISHIZAKI Takahiro; JP
児島 直克 KOJIMA Naokatsu; JP
川▲崎▼ 浩由 KAWASAKI Hiroyoshi; JP
Agent:
特許業務法人山口国際特許事務所 YAMAGUCHI INTERNATIONAL PATENT FIRM; 東京都台東区上野3-3-8 ワイゼムビル2F A号室 Waizemu Building 2F #A, 3-3-8, Ueno, Taito-ku, Tokyo 1100005, JP
Priority Data:
2017-17127406.09.2017JP
Title (EN) FLUX
(FR) FLUX
(JA) フラックス
Abstract:
(EN) Provided is a flux which enables improvement of solderability, while maintaining activeness by suppressing the formation of an ester by a reaction between an organic acid and a hydroxy group of an alcohol that is contained in a solvent. A flux which contains from 40 mass% to 90 mass% (inclusive) of water, from 2 mass% to 15 mass% (inclusive) of an organic acid, and more than 0 mass% but 48 mass% or less of a solvent that has a hydroxy group, and which is configured such that the content ratio of carboxylic acid ester units that are esterified by the organic acid and the hydroxy group contained in the solvent is from 0 unit mol% to 50 unit mol% (inclusive) if the molar mass% of organic acid carboxyl group units in the organic acid is taken as 100 unit mol%.
(FR) L'invention concerne un flux permettant d'améliorer la soudabilité, tout en maintenant l'activité par suppression de la formation d'un ester par une réaction entre un acide organique et un groupe hydroxy d'un alcool qui est contenu dans un solvant. Un flux qui contient de 40 % en masse à 90 % en masse (inclusivement) d'eau, de 2 % en masse à 15 % en masse (inclusivement) d'un acide organique, et plus de 0 % en masse mais 48 % en masse ou moins d'un solvant qui a un groupe hydroxy, et qui est configuré de telle sorte que le rapport de teneur en unités d'ester d'acide carboxylique qui sont estérifiées par l'acide organique et le groupe hydroxy contenu dans le solvant soit de 0 à 50 % en moles d'unité (inclusivement) si le % en masse molaire d'unités de groupe carboxyle d'acide organique dans l'acide organique est pris en tant que 100 % en moles d'unité.
(JA) 有機酸と、溶剤に含まれるアルコールのヒドロキシ基とが反応してエステルを形成すること抑制して活性を維持するとともに、はんだ付け性を良好にするフラックスを提供する。 水を40質量%以上90質量%以下、有機酸を2質量%以上15質量%以下、ヒドロキシ基を有する溶剤を0質量%超48質量%以下含有し、有機酸が有する有機酸カルボキシル基ユニットのモル質量%を100ユニットモル%としたときに、溶剤に含まれるヒドロキシ基と有機酸とによってエステル化したカルボン酸エステルユニットの含有割合が0ユニットモル%以上50ユニットモル%以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)