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1. (WO2019049911) COMPOSITION FOR HEAT DISSIPATING MEMBER, HEAT DISSIPATING MEMBER, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING HEAT DISSIPATING MEMBER
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Pub. No.: WO/2019/049911 International Application No.: PCT/JP2018/032945
Publication Date: 14.03.2019 International Filing Date: 05.09.2018
IPC:
C09K 5/14 (2006.01) ,C08L 87/00 (2006.01) ,H01L 23/373 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08
Materials not undergoing a change of physical state when used
14
Solid materials, e.g. powdery or granular
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
87
Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
JNC株式会社 JNC CORPORATION [JP/JP]; 東京都千代田区大手町二丁目2番1号 2-1, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008105, JP
Inventors:
滝沢 和宏 TAKIZAWA, Kazuhiro; JP
氏家 研人 UJIIYE, Kento; JP
國信 隆史 KUNINOBU, Takafumi; JP
藤原 武 FUJIWARA, Takeshi; JP
Agent:
宮川 貞二 MIYAGAWA, Teiji; JP
金子 美代子 KANEKO, Miyoko; JP
Priority Data:
2017-17147706.09.2017JP
Title (EN) COMPOSITION FOR HEAT DISSIPATING MEMBER, HEAT DISSIPATING MEMBER, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING HEAT DISSIPATING MEMBER
(FR) COMPOSITION POUR ÉLÉMENT DE DISSIPATION DE CHALEUR, ÉLÉMENT DE DISSIPATION DE CHALEUR, DISPOSITIF ÉLECTRONIQUE, ET PROCÉDÉ DE PRODUCTION D'UN ÉLÉMENT DE DISSIPATION DE CHALEUR
(JA) 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
Abstract:
(EN) The present invention provides a composition capable of forming a heat dissipating member having high thermal conductivity, and further having high heat resistance and low hygroscopicity, as well as a heat dissipating member. This composition for a heat dissipating member contains: a first inorganic filler 1, which is thermally conductive and is bonded to one end of a first coupling agent 11; a second inorganic filler 2, which is thermally conductive and is bonded to one end of a second coupling agent 12; and a polymerizable compound 22 having a bi- or higher functional hydroxy group and is capable of forming a heat dissipating member in which the first inorganic filler 1 and the second inorganic filler 2 are bonded together, in a curing process, through the first coupling agent 11, the polymerizable compound 22, and the second coupling agent 12.
(FR) La présente invention concerne une composition capable de former un élément de dissipation de chaleur ayant une conductivité thermique élevée, et ayant en outre une résistance à la chaleur élevée et une faible hygroscopicité, ainsi qu'un élément de dissipation de chaleur. Cette composition pour un élément de dissipation de chaleur contient : une première charge inorganique 1, qui est thermoconductrice et est liée à une extrémité d'un premier agent de couplage 11 ; une seconde charge inorganique, qui est thermoconductrice et est liée à une extrémité d'un second agent de couplage ; et un composé polymérisable 22 ayant un groupe hydroxy bi-fonctionnel ou supérieur et est apte à former un élément de dissipation de chaleur dans lequel la première charge inorganique 1 et la seconde charge inorganique 2 sont liées ensemble, dans un processus de durcissement, à travers le premier agent de couplage 11, le composé polymérisable 22 et le second agent de couplage 12.
(JA) 本発明は、高熱伝導性を有し、さらに高耐熱性、低吸湿性を有する放熱部材を形成可能な組成物および放熱部材である。本発明の放熱部材用組成物は、第1のカップリング剤11の一端と結合した熱伝導性の第1の無機フィラー1と;第2のカップリング剤12の一端と結合した熱伝導性の第2の無機フィラー2と;2官能以上のヒドロキシ基を有する重合性化合物22と;を含有し、硬化処理により、第1の無機フィラー1と第2の無機フィラー2が、第1のカップリング剤11、重合性化合物22、第2のカップリング剤12を介して結合した放熱部材を形成可能な組成物である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)