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1. (WO2019049781) CIRCUIT BLOCK ASSEMBLY
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Pub. No.: WO/2019/049781 International Application No.: PCT/JP2018/032351
Publication Date: 14.03.2019 International Filing Date: 31.08.2018
IPC:
H01L 23/36 (2006.01) ,H01L 23/473 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
玉山 孟明 TAMAYAMA, Takeaki; JP
元木 章博 MOTOKI, Akihiro; JP
Agent:
山尾 憲人 YAMAO, Norihito; JP
吉田 環 YOSHIDA, Tamaki; JP
Priority Data:
2017-17238607.09.2017JP
Title (EN) CIRCUIT BLOCK ASSEMBLY
(FR) ENSEMBLE BLOC-CIRCUIT
(JA) 回路ブロック集合体
Abstract:
(EN) The present invention is a circuit block assembly including a plurality of circuit blocks, with each comprising a wiring board and a semiconductor element disposed on one main surface of the wiring board. The plurality of circuit blocks each have a metal heat spreader connected to the semiconductor element directly or via a thermally conductive member, and a thermally conductive sheet thermally connected to the heat spreader. The thermally conductive sheet has a specific resistance that is larger than the specific resistance of the heat spreader.
(FR) La présente invention concerne un ensemble bloc-circuit comportant une pluralité de blocs-circuits comprenant chacun une carte de câblage et un élément semi-conducteur disposé sur une surface principale de la carte de câblage. La pluralité de blocs-circuits comprennent chacun un dissipateur thermique métallique connecté à l'élément semi-conducteur directement ou par l'intermédiaire d'un élément thermoconducteur, ainsi qu'une feuille thermoconductrice connectée thermiquement au dissipateur thermique. La feuille thermoconductrice présente une résistance spécifique supérieure à la résistance spécifique du dissipateur thermique.
(JA) 本発明は、配線板と該配線板の一方主面上に配置された半導体素子とを有して成る回路ブロックを複数有する回路ブロック集合体であって、前記複数の回路ブロックは、それぞれ、前記半導体素子に直接的、または熱伝導性部材を介して接続された金属製のヒートスプレッダと、前記各ヒートスプレッダに熱的に接続された熱伝導性シートと、を有し、前記熱伝導性シートは、前記ヒートスプレッダの比抵抗よりも大きな比抵抗を有する、回路ブロック集合体を提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)