Processing

Please wait...

Settings

Settings

Goto Application

1. WO2019049781 - CIRCUIT BLOCK ASSEMBLY

Publication Number WO/2019/049781
Publication Date 14.03.2019
International Application No. PCT/JP2018/032351
International Filing Date 31.08.2018
IPC
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
G06F 1/163
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
163Wearable computers, e.g. on a belt
G06F 1/203
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
203for portable computers, e.g. for laptops
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L 23/3672
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3672Foil-like cooling fins or heat sinks
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20154
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20009using a gaseous coolant in electronic enclosures
20136Forced ventilation, e.g. by fans
20154Heat dissipaters coupled to components
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 玉山 孟明 TAMAYAMA, Takeaki
  • 元木 章博 MOTOKI, Akihiro
Agents
  • 山尾 憲人 YAMAO, Norihito
  • 吉田 環 YOSHIDA, Tamaki
Priority Data
2017-17238607.09.2017JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT BLOCK ASSEMBLY
(FR) ENSEMBLE BLOC-CIRCUIT
(JA) 回路ブロック集合体
Abstract
(EN)
The present invention is a circuit block assembly including a plurality of circuit blocks, with each comprising a wiring board and a semiconductor element disposed on one main surface of the wiring board. The plurality of circuit blocks each have a metal heat spreader connected to the semiconductor element directly or via a thermally conductive member, and a thermally conductive sheet thermally connected to the heat spreader. The thermally conductive sheet has a specific resistance that is larger than the specific resistance of the heat spreader.
(FR)
La présente invention concerne un ensemble bloc-circuit comportant une pluralité de blocs-circuits comprenant chacun une carte de câblage et un élément semi-conducteur disposé sur une surface principale de la carte de câblage. La pluralité de blocs-circuits comprennent chacun un dissipateur thermique métallique connecté à l'élément semi-conducteur directement ou par l'intermédiaire d'un élément thermoconducteur, ainsi qu'une feuille thermoconductrice connectée thermiquement au dissipateur thermique. La feuille thermoconductrice présente une résistance spécifique supérieure à la résistance spécifique du dissipateur thermique.
(JA)
本発明は、配線板と該配線板の一方主面上に配置された半導体素子とを有して成る回路ブロックを複数有する回路ブロック集合体であって、前記複数の回路ブロックは、それぞれ、前記半導体素子に直接的、または熱伝導性部材を介して接続された金属製のヒートスプレッダと、前記各ヒートスプレッダに熱的に接続された熱伝導性シートと、を有し、前記熱伝導性シートは、前記ヒートスプレッダの比抵抗よりも大きな比抵抗を有する、回路ブロック集合体を提供する。
Also published as
Latest bibliographic data on file with the International Bureau