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1. (WO2019049766) ELECTRONIC DEVICE
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Pub. No.: WO/2019/049766 International Application No.: PCT/JP2018/032125
Publication Date: 14.03.2019 International Filing Date: 30.08.2018
IPC:
H05K 7/14 (2006.01) ,G06F 1/20 (2006.01) ,H05K 7/10 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
20
Cooling means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
10
Plug-in assemblages of components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
NECプラットフォームズ株式会社 NEC PLATFORMS, LTD. [JP/JP]; 神奈川県川崎市高津区北見方二丁目6番1号 2-6-1, Kitamikata, Takatsu-ku, Kawasaki-shi, Kanagawa 2138511, JP
Inventors:
庄司 和正 SHOJI Kazumasa; JP
長谷川 亮 HASEGAWA Akira; JP
Agent:
棚井 澄雄 TANAI Sumio; JP
森 隆一郎 MORI Ryuichirou; JP
松沼 泰史 MATSUNUMA Yasushi; JP
伊藤 英輔 ITO Eisuke; JP
Priority Data:
2017-17313108.09.2017JP
Title (EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract:
(EN) An electronic device that is provided with: a substrate which comprises a first connector and a second connector; a first module which is able to be inserted/removed into/from the first connector; and a second module which is arranged so as to face the plane direction of the first module, and which is able to be inserted/removed into/from the second connector. The first module has a cut portion; and at least a part of the second module is positioned in the cut portion.
(FR) La présente invention concerne un dispositif électronique qui est pourvu de : un substrat qui comprend un premier connecteur et un deuxième connecteur ; un premier module qui peut être inséré/retiré dans/depuis le premier connecteur ; et un deuxième module qui est agencé de façon à faire face à la direction du plan du premier module, et qui peut être inséré/retiré dans/depuis le deuxième connecteur. Le premier module comporte une partie découpée ; et au moins une partie du deuxième module est positionnée dans la partie découpée.
(JA) 第1のコネクタおよび第2のコネクタを有する基板と、前記第1のコネクタに挿抜可能な第1モジュールと、前記第1モジュールの面方向に対向して設けられ、前記第2のコネクタに挿抜可能な第2モジュールと、を備え、前記第1モジュールは、切り欠き部を有し、前記第2モジュールの少なくとも一部が前記切り欠き部に位置する、電子機器。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)