Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019049745) ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/049745 International Application No.: PCT/JP2018/031927
Publication Date: 14.03.2019 International Filing Date: 29.08.2018
IPC:
H05K 1/14 (2006.01) ,G06F 1/18 (2006.01) ,H05K 7/14 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
18
Packaging or power distribution
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
Applicants:
NECプラットフォームズ株式会社 NEC PLATFORMS, LTD. [JP/JP]; 神奈川県川崎市高津区北見方二丁目6番1号 2-6-1, Kitamikata, Takatsu-ku, Kawasaki-shi, Kanagawa 2138511, JP
Inventors:
庄司 和正 SHOJI Kazumasa; JP
長谷川 亮 HASEGAWA Akira; JP
Agent:
棚井 澄雄 TANAI Sumio; JP
森 隆一郎 MORI Ryuichirou; JP
松沼 泰史 MATSUNUMA Yasushi; JP
伊藤 英輔 ITO Eisuke; JP
Priority Data:
2017-17238307.09.2017JP
Title (EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract:
(EN) Provided is an electronic device comprising a first substrate and a second substrate insertably and removably connected to the surface of the first substrate, the second substrate having a connection connector by which an electronic component can connect to both a first surface and a second surface.
(FR) L'invention concerne un dispositif électronique comprenant un premier substrat et un second substrat connectés amovibles et par insertion à la surface du premier substrat, le second substrat ayant un connecteur de connexion qui permet à un composant électronique de se connecter à la fois à une première surface et à une seconde surface.
(JA) 第1の基板と、前記第1の基板の表面に挿抜可能に接続される第2の基板と、を備え、前記第2の基板は、第1面と第2面との双方に、電子部品が接続可能な接続コネクタを有している電子機器。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)