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1. (WO2019049735) METHOD FOR FORMING INSULATING FILM, APPARATUS FOR PROCESSING SUBSTRATE, AND SYSTEM FOR PROCESSING SUBSTRATE
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Pub. No.: WO/2019/049735 International Application No.: PCT/JP2018/031810
Publication Date: 14.03.2019 International Filing Date: 28.08.2018
IPC:
H01L 21/312 (2006.01) ,B05C 9/12 (2006.01) ,B05C 9/14 (2006.01) ,B05C 13/02 (2006.01) ,B05D 1/36 (2006.01) ,B05D 3/02 (2006.01) ,B05D 3/06 (2006.01) ,B05D 7/24 (2006.01) ,H01L 21/76 (2006.01) ,B05C 11/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31
to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
312
Organic layers, e.g. photoresist
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
9
Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups B05C1/-B05C7/159
08
for applying liquid or other fluent material and performing an auxiliary operation
12
the auxiliary operation being performed after the application
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
9
Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups B05C1/-B05C7/159
08
for applying liquid or other fluent material and performing an auxiliary operation
14
the auxiliary operation involving heating
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
13
Means for manipulating or holding work, e.g. for separate articles
02
for particular articles
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1
Processes for applying liquids or other fluent materials
36
Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3
Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
02
by baking
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3
Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
06
by exposure to radiation
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
24
for applying particular liquids or other fluent materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
76
Making of isolation regions between components
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11
Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
02
Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface; Control of the thickness of a coating
08
Spreading liquid or other fluent material by manipulating the work, e.g. tilting
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors:
村松 誠 MURAMATSU, Makoto; JP
源島 久志 GENJIMA, Hisashi; JP
Agent:
特許業務法人弥生特許事務所 YAYOY PATENT OFFICE; 神奈川県横浜市中区弥生町2丁目15番1号ストークタワー大通り公園3 601号 601, Storktower Odori-Park 3, 2-15-1, Yayoicho, Naka-ku, Yokohama-shi, Kanagawa 2310058, JP
Priority Data:
2017-17428711.09.2017JP
Title (EN) METHOD FOR FORMING INSULATING FILM, APPARATUS FOR PROCESSING SUBSTRATE, AND SYSTEM FOR PROCESSING SUBSTRATE
(FR) PROCÉDÉ DE FORMATION DE FILM ISOLANT, APPAREIL DE TRAITEMENT DE SUBSTRAT ET SYSTÈME DE TRAITEMENT DE SUBSTRAT
(JA) 絶縁膜の成膜方法、基板処理装置及び基板処理システム
Abstract:
(EN) [Problem] To provide a technique by which good film quality can be achieved when forming a silicon oxide-containing insulation film as a coating film on a substrate. [Solution] A coating solution containing a polysilazane is applied onto a wafer W, the solvent of the coating solution is volatilized, and then the coating film is irradiated with ultraviolet rays in a nitrogen atmosphere before performing a curing process. Dangling bonds are thus generated in silicon which is a pre-hydrolyzed site in the polysilazane. Therefore, the energy required for hydrolysis is reduced, and unhydrolyzed sites are thus reduced even when the temperature of the curing process is set to 350°C. Since efficient dehydration condensation occurs as a result, the degree of crosslinking is improved, and a dense (high-quality) insulation film can be formed. In addition, by forming a protective film on the surface of the coating film after the coating film has been irradiated with ultraviolet rays, the reaction of dangling bonds prior to the curing process can be suppressed, and the film quality of the coating film is improved.
(FR) Le problème décrit par la présente invention est de produire une technique permettant d'obtenir une bonne qualité de film lors de la formation d'un film d'isolation contenant de l'oxyde de silicium en tant que film de revêtement sur un substrat. La solution selon l'invention consiste à appliquer une solution de revêtement contenant un polysilazane sur une tranche (W), à volatiliser le solvant de la solution de revêtement, puis à exposer le film de revêtement à des rayons ultraviolets dans une atmosphère d'azote avant de mettre en œuvre un procédé de durcissement. Des liaisons pendantes sont ainsi produites dans du silicium qui est un site pré-hydrolysé dans le polysilazane. Par conséquent, l'énergie nécessaire à l'hydrolyse est réduite, et les sites non hydrolysés sont ainsi réduits même lorsque la température du procédé de durcissement est réglée à 350 °C. Étant donné qu'une condensation de déshydratation efficace se produit en conséquence, le degré de réticulation est amélioré, et un film d'isolation dense (de haute qualité) peut être formé. De plus, la formation d'un film protecteur sur la surface du film de revêtement après exposition du film de revêtement à des rayons ultraviolets permet de supprimer la réaction de liaisons pendantes avant la mise en œuvre du procédé de durcissement, et d'améliorer la qualité de film du film de revêtement.
(JA) 【課題】基板上に酸化シリコンを含む絶縁膜を塗布膜として形成するにあたって、良好な膜質が得られる技術を提供すること。 【解決手段】ポリシラザンを含む塗布液をウエハWに塗布し、塗布液の溶媒を揮発させた後、キュア工程を行う前に、窒素雰囲気で前記塗布膜に紫外線を照射している。このためポリシラザンにおける予め加水分解される部位であるシリコンに未結合手を生成される。そのため加水分解に必要なエネルギーが低下することから、キュア工程の温度を350℃としたときにも、加水分解されずに残る部位が少なくなる。この結果効率的に脱水縮合が起こるので、架橋率が向上して緻密な(良質な膜質である)絶縁膜を成膜することができる。 また前記塗布膜に紫外線を照射した後塗布膜の表面に保護膜を形成することにより、キュア工程前における未結合手の反応を抑制することができ、塗布膜の膜質が良好になる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)