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1. (WO2019049662) SENSOR CHIP AND ELECTRONIC MACHINE
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Pub. No.: WO/2019/049662 International Application No.: PCT/JP2018/030905
Publication Date: 14.03.2019 International Filing Date: 22.08.2018
IPC:
H01L 27/146 (2006.01) ,G01S 17/10 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
17
Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
02
Systems using the reflection of electromagnetic waves other than radio waves
06
Systems determining position data of a target
08
for measuring distance only
10
using transmission of interrupted pulse-modulated waves
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
安 陽太郎 YASU Yohtaro; JP
半澤 克彦 HANZAWA Katsuhiko; US
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
15/695,40005.09.2017US
Title (EN) SENSOR CHIP AND ELECTRONIC MACHINE
(FR) PUCE DE CAPTEUR ET MACHINE ÉLECTRONIQUE
(JA) センサチップおよび電子機器
Abstract:
(EN) The present invention relates to a sensor chip and an electronic machine allowing faster controls to be executed. The invention comprises: a pixel array section that is a region shaped into a rectangle, wherein a plurality of sensor elements are disposed in an array form; and a global control circuit wherein driving elements, whereby sensor elements are driven simultaneously, are disposed to be oriented in one direction, the length direction thereof being disposed so as to follow the long edge of the pixel array section, the driving elements being connected to respective control lines, whereof each is provided at each column of the sensor elements. The present technique is applicable, for instance, to ToF sensors.
(FR) La présente invention concerne une puce de capteur et une machine électronique permettant d'exécuter des commandes plus rapides. L'invention comprend : une section de matrice de pixels qui est une zone de forme rectangulaire, une pluralité d'éléments capteurs étant disposés selon un agencement matriciel ; et un circuit de commande global dans lequel des éléments d'attaque, permettant d'attaquer simultanément les éléments capteurs, sont disposés de façon à être orientés dans une direction, leur sens de la longueur suivant le bord long de la section de matrice de pixels, les éléments d'attaque étant connectés à des lignes de commande respectives, chacune étant placée au niveau de chaque colonne des éléments capteurs. La présente technique est applicable, par exemple, à des capteurs ToF.
(JA) 本開示は、より高速な制御を行うことができるようにするセンサチップおよび電子機器に関する。 複数のセンサ素子がアレイ状に配置された矩形形状の領域のピクセルアレイ部と、センサ素子を同時的に駆動する駆動素子が一方向に向かって配置され、その長手方向がピクセルアレイ部の長辺に沿うように配置され、センサ素子の1列ごとに設けられる制御線に駆動素子がそれぞれ接続されるグローバル制御回路とを備える。本技術は、例えば、ToFセンサに適用できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)