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1. (WO2019049659) METHOD FOR POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP
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Pub. No.: WO/2019/049659 International Application No.: PCT/JP2018/030894
Publication Date: 14.03.2019 International Filing Date: 22.08.2018
IPC:
H01L 21/304 (2006.01) ,B24B 37/013 (2012.01) ,B24B 49/04 (2006.01) ,B24B 49/10 (2006.01) ,B24B 49/12 (2006.01) ,B24B 49/16 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
005
Control means for lapping machines or devices
013
Devices or means for detecting lapping completion
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
02
according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
04
involving measurement of the workpiece at the place of grinding during grinding operation
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
10
involving electrical means
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
12
involving optical means
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
16
taking regard of the load
Applicants:
株式会社荏原製作所 EBARA CORPORATION [JP/JP]; 東京都大田区羽田旭町11番1号 11-1, Haneda Asahi-cho, Ota-ku, Tokyo 1448510, JP
Inventors:
戸川 哲二 TOGAWA, Tetsuji; JP
曽布川 拓司 SOBUKAWA, Hiroshi; JP
畠山 雅規 HATAKEYAMA, Masahiro; JP
Agent:
小野 新次郎 ONO, Shinjiro; JP
宮前 徹 MIYAMAE, Toru; JP
鐘ヶ江 幸男 KANEGAE, Yukio; JP
渡邊 誠 WATANABE, Makoto; JP
Priority Data:
2017-17030205.09.2017JP
Title (EN) METHOD FOR POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP
(FR) PROCÉDÉ DE POLISSAGE D'UN SUBSTRAT COMPRENANT UNE PUCE FONCTIONNELLE
(JA) 機能性チップを備える基板を研磨する方法
Abstract:
(EN) A polishing end-point position is detected in order to end polishing at an appropriate position. According to one embodiment of the present invention, a method for chemically and mechanically polishing a substrate provided with a functional chip is provided. This method has: a step for placing a functional chip on a substrate; a step for placing an end-point detection element on the substrate; a step for sealing the substrate on which the functional chip and the end-point detection element are placed with an insulating material; a step for polishing the insulating material; and a step for detecting a polishing end point on the basis of the end-point detection element when the insulating material is polished.
(FR) L'invention concerne une position de point d'extrémité de polissage qui est détectée afin de terminer le polissage à une position appropriée. Selon un mode de réalisation, l'invention concerne un procédé de polissage chimique et mécanique d'un substrat comprenant une puce fonctionnelle. Ce procédé comprend : une étape consistant à placer une puce fonctionnelle sur un substrat ; une étape consistant à placer un élément de détection de point d'extrémité sur le substrat ; une étape consistant à étanchéifier le substrat sur lequel la puce fonctionnelle et l'élément de détection de point d'extrémité sont placés avec un matériau isolant ; une étape de polissage du matériau isolant ; et une étape de détection d'un point d'extrémité de polissage sur la base de l'élément de détection de point d'extrémité lorsque le matériau isolant est poli.
(JA) 適切な位置で研磨を終了するために、研磨の終点位置を検知する。 一実施形態によれば、機能性チップを備える基板を化学機械的に研磨する方法が提供され、かかる方法は、基板に機能性チップを配置するステップと、前記基板に終点検知要素を配置するステップと、前記機能性チップおよび前記終点検知要素が配置された基板を絶縁材で封止するステップと、前記絶縁材を研磨するステップと、前記絶縁材を研磨しているときに、前記終点検知要素に基づいて研磨の終点を検知するステップと、を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)