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1. (WO2019049592) ELECTRONIC MODULE
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Pub. No.: WO/2019/049592 International Application No.: PCT/JP2018/029759
Publication Date: 14.03.2019 International Filing Date: 08.08.2018
IPC:
H01Q 1/24 (2006.01) ,H01Q 23/00 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
24
with receiving set
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
23
Aerials with active circuits or circuit elements integrated within them or attached to them
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
矢▲崎▼ 浩和 YAZAKI, Hirokazu; JP
Agent:
河本 尚志 KAWAMOTO, Takashi; JP
Priority Data:
2017-17071205.09.2017JP
Title (EN) ELECTRONIC MODULE
(FR) MODULE ÉLECTRONIQUE
(JA) 電子モジュール
Abstract:
(EN) Provided is an electronic module which is able to be reduced in size and cost, and which has a wireless communication function, while being suppressed in input and output of low-frequency noises and high-frequency noises. This electronic module is provided with: a substrate 1; electronic components (a DC-DC converter 6, an RFIC 7 and a capacitor 8) which are mounted on the substrate 1; a magnetic body 10 which is formed on the substrate 1 so as to cover the electronic components; and a metal shield 11 which is formed on the magnetic body 10. An electronic circuit is configured using the electronic components; and the electronic circuit comprises a signal circuit. The metal shield 11 comprises: ground connection parts 11B, 11C, 11D which are connected to the ground electrode of the substrate 1; and a circuit connection part 11A which is connected to the signal circuit at a position different from the ground connection parts 11B, 11C, 11D.
(FR) La présente invention concerne un module électronique qui peut être réduit en termes de taille et de coût, et qui a une fonction de communication sans fil, tout en étant supprimé en termes d'entrée et de sortie de bruits à basse fréquence et de bruits à haute fréquence. Ce module électronique est pourvu de : un substrat 1; des composants électroniques (un convertisseur CC-CC 6, un RFIC 7 et un condensateur 8) qui sont montés sur le substrat 1; un corps magnétique 10 qui est formé sur le substrat 1 de façon à recouvrir les composants électroniques; et un blindage métallique 11 qui est formé sur le corps magnétique 10. Un circuit électronique est configuré au moyen des composants électroniques; et le circuit électronique comprend un circuit de signal. Le blindage métallique 11 comprend : des parties de connexion de masse 11B, 11C, 11D qui sont connectées à l'électrode de masse du substrat 1; et une partie de connexion de circuit 11A qui est connectée au circuit de signal à une position différente des parties de connexion de masse 11B, 11C, 11D.
(JA) 小型化および低コスト化が可能で、低周波ノイズおよび高周波ノイズの入出が抑制された、無線通信機能を備えた電子モジュールを提供する。 基板1と、基板1に実装された電子部品(DC-DCコンバータ6、RFIC7、キャパシタ8)と、電子部品を覆って基板1に形成された磁性体10と、磁性体10に形成された金属シールド11と、を備え、電子部品を使って電子回路が構成され、電子回路は信号回路を含み、金属シールド11が、基板1のグランド電極に接続されたグランド接続部11B、11C、11Dと、グランド接続部11B、11C、11Dと異なる位置において信号回路に接続された回路接続部11Aと、を有するものとする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)