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1. (WO2019049588) METHODS AND SYSTEMS FOR CLAMPING A SUBSTRATE
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Pub. No.: WO/2019/049588 International Application No.: PCT/JP2018/029695
Publication Date: 14.03.2019 International Filing Date: 31.07.2018
IPC:
G03F 7/20 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
MAPPER LITHOGRAPHY IP B.V. [NL/NL]; Computerlaan 15 2628 XK DELFT, NL
Inventors:
SMITS, Marc; NL
Agent:
KURATA, Masatoshi; c/o SUZUYE & SUZUYE, 11th Floor, Celestine Shiba Mitsui Bldg., 3-23-1 Shiba, Minato-ku, Tokyo 1050014, JP
Priority Data:
62/555,08707.09.2017US
Title (EN) METHODS AND SYSTEMS FOR CLAMPING A SUBSTRATE
(FR) PROCÉDÉS ET SYSTÈMES DE REVÊTEMENT D'UN SUBSTRAT
Abstract:
(EN) Methods and arrangement for clamping substrates to a support using adhesive material area disclosed. The method comprises providing a support comprising a first surface defining a plane; applying adhesive material on at least portions of the first surface; and placing the substrate onto the adhesive material, wherein the adhesive material forms a plurality of support locations supporting the substrate. Preferably the adhesive material is cured at least partly during the application of a substantially uniformly distributed force to the substrate in the direction of the support. The arrangements comprise a support comprising a first surface, for supporting the substrate via adhesive material, whereby the first surface defines a plane. Preferably it also comprises an arrangement for providing electromagnetic radiation, thermal energy, and/or a chemical substance to the adhesive material, and an arrangement for providing a substantially uniformly distributed force to the substrate in the direction of the support.
(FR) L'invention concerne des procédés et un agencement pour serrer des substrats sur un support à l'aide d'une zone de matériau adhésif. Le procédé comprend la fourniture d'un support comprenant une première surface définissant un plan; l'application d'un matériau adhésif sur au moins des parties de la première surface; et le placement du substrat sur le matériau adhésif, le matériau adhésif formant une pluralité d'emplacements de support supportant le substrat. De préférence, le matériau adhésif est durci au moins partiellement pendant l'application d'une force uniformément distribuée sur le substrat dans la direction du support. Les agencements comprennent un support comprenant une première surface, pour supporter le substrat par l'intermédiaire d'un matériau adhésif, la première surface définissant un plan. De préférence, il comprend également un agencement pour fournir un rayonnement électromagnétique, de l'énergie thermique et/ou une substance chimique au matériau adhésif, et un agencement pour fournir une force distribuée sensiblement uniformément au substrat dans la direction du support.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)