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1. (WO2019049493) MODULE COMPONENT
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Pub. No.: WO/2019/049493 International Application No.: PCT/JP2018/025242
Publication Date: 14.03.2019 International Filing Date: 03.07.2018
IPC:
H01L 23/00 (2006.01) ,H01L 23/28 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/18 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO.,LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
鎌田晃史 KAMADA, Koji; JP
Agent:
西澤均 NISHIZAWA, Hitoshi; JP
野末貴弘 NOZUE, Takahiro; JP
Priority Data:
2017-17182407.09.2017JP
Title (EN) MODULE COMPONENT
(FR) COMPOSANT DE MODULE
(JA) モジュール部品
Abstract:
(EN) This module component 100 comprises a base board 10, a plurality of mounted components 20 mounted on one of the main surfaces of the base board 10, non-magnetic bodies 30 which cover at least some of the electrodes that are different from the respective ground electrodes of the plurality of mounted components 20, and a magnetic body 40 covering the one of the main surfaces of the base board 10, the plurality of mounted components 20, and the non-magnetic bodies 30. Among the plurality of mounted components 20 mounted on the base board 10, at least some of the electrodes that are different from the ground electrodes are covered by the non-magnetic bodies 30, therefore, noise propagation among the plurality of mounted components 20 can be suppressed. In addition, the one of the main surfaces of the base board 10, the mounted components 20, and the non-magnetic bodies 30 are covered by the magnetic body 40, therefore, emission of noise to the exterior of the module component can be suppressed.
(FR) L'invention concerne un composant de module 100 comprenant une plaque de base 10, une pluralité de composants montés 20 montés sur l'une des surfaces principales de la plaque de base 10, des corps non magnétiques 30 qui recouvrent au moins certaines des électrodes qui sont différentes des électrodes de masse respectives de la pluralité de composants montés 20, et d'un corps magnétique 40 qui recouvre l'une des surfaces principales de la plaque de base 10, de la pluralité de composants montés 20 et des corps non magnétiques 30. Parmi la pluralité de composants montés 20 montés sur la plaque de base 10, au moins certaines des électrodes qui sont différentes des électrodes de masse sont recouvertes par les corps non magnétiques 30, par conséquent, la propagation du bruit parmi la pluralité de composants montés 20 peut être supprimée. De plus, les une des surfaces principales de la plaque de base 10, des composants montés 20, et des corps non magnétiques 30 sont recouverts par le corps magnétique 40, ce qui permet de supprimer l'émission de bruit vers l'extérieur du composant de module.
(JA) モジュール部品100は、基板10と、基板10の一方主面に実装された複数の実装部品20と、複数の実装部品20それぞれのグランド電極と異なる電極の少なくとも一部を覆う非磁性体30と、基板10の一方主面、複数の実装部品20、および、非磁性体30を覆う磁性体40とを備える。基板10に実装されている複数の実装部品20のうち、グランド電極と異なる電極の少なくとも一部が非磁性体30で覆われているので、複数の実装部品20間でのノイズ伝搬を抑制することができる。また、磁性体40によって、基板10の一方主面、実装部品20および非磁性体30が覆われているので、モジュール部品外部へのノイズの放射を抑制することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)