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1. (WO2019049400) POWER MODULE, PRODUCTION METHOD THEREFOR, AND POWER CONVERSION DEVICE
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Pub. No.: WO/2019/049400 International Application No.: PCT/JP2018/008611
Publication Date: 14.03.2019 International Filing Date: 06.03.2018
IPC:
H01L 25/07 (2006.01) ,H01L 23/28 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
人見 晴子 HITOMI, Haruko; JP
Agent:
村上 加奈子 MURAKAMI, Kanako; JP
松井 重明 MATSUI, Jumei; JP
倉谷 泰孝 KURATANI, Yasutaka; JP
伊達 研郎 DATE, Kenro; JP
Priority Data:
2017-17033005.09.2017JP
Title (EN) POWER MODULE, PRODUCTION METHOD THEREFOR, AND POWER CONVERSION DEVICE
(FR) MODULE DE PUISSANCE, SON PROCÉDÉ DE PRODUCTION ET DISPOSITIF DE CONVERSION DE PUISSANCE
(JA) パワーモジュール及びその製造方法並びに電力変換装置
Abstract:
(EN) In this invention a power module is obtained in which the occurrence of detachment between a sealing resin and an adhesive has been reduced. The power module comprises: an insulated substrate (5) having a semiconductor element (1) installed on the front surface thereof; a base plate (10) joined to the back surface of the insulated substrate (5); a case member (7) that encloses, together with the base plate (10), the insulated substrate (5), and that is provided with an inclined surface (71) that, from the inner periphery side of the bottom surface of the case member (7) which makes contact with the top surface of the base plate (10), becomes increasingly distant from the top surface of the base plate (10) towards the outer periphery side of the base plate (10); an adhesive member (9) filled between the base plate (10) and the sloped surface (71), adhering the base plate (10) to the case member (7); and a filling member (12) filled in the region enclosed by the base plate (10) and the case member (7).
(FR) Dans la présente invention, un module de puissance est obtenu dans lequel l'apparition de détachement entre une résine d'étanchéité et un adhésif a été réduite. Le module de puissance comprend : un substrat isolé (5) ayant un élément semi-conducteur (1) installé sur la surface avant de celui-ci ; une plaque de base (10) reliée à la surface arrière du substrat isolé (5) ; un élément de boîtier (7) qui entoure, conjointement avec la plaque de base (10), le substrat isolé (5), et qui comprend une surface inclinée (71) qui, à partir du côté de périphérie interne de la surface inférieure de l'élément de boîtier (7) qui entre en contact avec la surface supérieure de la plaque de base (10), devient de plus en plus éloignée de la surface supérieure de la plaque de base (10) vers le côté de périphérie externe de la plaque de base (10) ; un élément adhésif (9) rempli entre la plaque de base (10) et la surface inclinée (71), adhérant la plaque de base (10) à l'élément de boîtier (7) ; et un élément de remplissage (12) rempli dans la région entourée par la plaque de base (10) et l'élément de boîtier (7).
(JA) 封止樹脂と接着剤との剥離の発生を抑制したパワーモジュールを得る。表面に半導体素子(1)が搭載された絶縁基板(5)と、絶縁基板(5)の裏面に接合されたベース板(10)と、ベース板(10)とで絶縁基板(5)を取り囲み、底面の内周部側がベース板(10)の表面と接し、底面にはベース板(10)の外周側へ向かうほどベース板(10)の表面から遠ざかる傾斜面(71)を設けたケース部材(7)と、ベース板(10)と傾斜面(71)との間に充填されベース板(10)とケース部材(7)とを接着する接着部材(9)と、ベース板(10)とケース部材(7)とで囲まれた領域に充填される充填部材(12)と、を備えたパワーモジュール。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)