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1. (WO2019048393) SPIN-ON INORGANIC OXIDE CONTAINING COMPOSITION USEFUL AS HARD MASKS AND FILLING MATERIALS WITH IMPROVED THERMAL STABILITY
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Pub. No.: WO/2019/048393 International Application No.: PCT/EP2018/073657
Publication Date: 14.03.2019 International Filing Date: 04.09.2018
IPC:
C23C 18/12 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02
by thermal decomposition
12
characterised by the deposition of inorganic material other than metallic material
Applicants:
AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À.R.L. [LU/LU]; 46 Place Guillaume II 1648 Luxembourg, LU
Inventors:
YAO, Huirong; US
CHO, JoonYeon; US
RAHMAN, M. Dalil; US
Agent:
FÉAUX DE LACROIX, Stefan; DE
Priority Data:
62/554,69506.09.2017US
Title (EN) SPIN-ON INORGANIC OXIDE CONTAINING COMPOSITION USEFUL AS HARD MASKS AND FILLING MATERIALS WITH IMPROVED THERMAL STABILITY
(FR) COMPOSITION POUR DÉPÔT À LA TOURNETTE CONTENANT UN OXYDE INORGANIQUE UTILE EN TANT QUE MASQUES DURS ET MATÉRIAUX DE REMPLISSAGE AYANT UNE STABILITÉ THERMIQUE AMÉLIORÉE
Abstract:
(EN) The present invention relates to a composition comprising; components a. c. and d; and optional component b. wherein, component a. is a metal compound having the structure (I), optional component b., is a polyol additive, having structure (VI), component c. is a high performance polymer additive, and component d. is a solvent. The present invention further relates to using this compositions in methods for manufacturing electronic devices through either the formation of a patterned films of high K material comprised of a metal oxide on a semiconductor substrate, or through the formation of patterned metal oxide comprised layer overlaying a semiconductor substrate which may be used to selectively etch the semiconductor substrate with a fluorine plasma.
(FR) La présente invention concerne une composition comprenant des constituants a, c et d, et un constituant b facultatif, le constituant a étant un composé métallique ayant la structure (I), le constituant b facultatif étant un additif polyol ayant la structure (VI), le constituant c étant un additif polymère à hautes performances et le constituant d étant un solvant. La présente invention concerne en outre l'utilisation de cette composition dans des procédés de fabrication de dispositifs électroniques soit par formation d'un film à motifs d'un matériau à coefficient K élevé constitué d'un oxyde métallique sur un substrat semi-conducteur, soit par formation d'une couche comprenant un oxyde métallique à motifs recouvrant un substrat semi-conducteur, ladite couche pouvant être utilisée pour graver sélectivement le substrat semi-conducteur avec un plasma de fluor.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)