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1. (WO2019048170) LIGHT-EMITTING COMPONENT AND METHOD FOR PRODUCING A LIGHT-EMITTING COMPONENT
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Pub. No.: WO/2019/048170 International Application No.: PCT/EP2018/071512
Publication Date: 14.03.2019 International Filing Date: 08.08.2018
IPC:
H01L 33/46 (2010.01) ,H01L 33/48 (2010.01) ,H01L 33/58 (2010.01) ,H01L 33/60 (2010.01) ,H01L 33/50 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
44
characterised by the coatings, e.g. passivation layer or anti-reflective coating
46
Reflective coating, e.g. dielectric Bragg reflector
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
60
Reflective elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
HAIBERGER, Luca; DE
CHOU, Sam; DE
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
10 2017 120 385.005.09.2017DE
Title (EN) LIGHT-EMITTING COMPONENT AND METHOD FOR PRODUCING A LIGHT-EMITTING COMPONENT
(FR) COMPOSANT ÉLECTROLUMINESCENT ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT ÉLECTROLUMINESCENT
(DE) LICHT EMITTIERENDES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES LICHT EMITTIERENDEN BAUELEMENTS
Abstract:
(EN) A light-emitting component (100) is specified which comprises a light-emitting semiconductor chip (1) having a light coupling-out surface (10), which is laterally surrounded by a first reflective material (2) in a positively locking manner, a film element (3) on the light coupling-out surface (10) and an optical element (4) on the film element (3), which is laterally surrounded by a second reflective material (5) in a positively locking manner, wherein there is a gas-filled gap (6) between the film element (3) and the optical element (4) at least in a partial region. Furthermore, a method for producing a light-emitting component (100) is specified.
(FR) Composant électroluminescent et procédé de fabrication d’un élément électroluminescent L’invention concerne un composant électroluminescent (100), qui comprend une puce de semi-conducteur (1) électroluminescente comprenant une face de découplage de la lumière (10), entourée latéralement par complémentarité de forme par un premier matériau réfléchissant (2), un élément en feuille (3) sur la face de découplage de la lumière (10) et un élément optique (4) sur l’élément en feuille (3), entouré latéralement par complémentarité de forme par un deuxième matériau réfléchissant (5) , une fente remplie de gaz (6) existant dans au moins une partie de la zone entre l’élément en feuille (3) et l’élément optique (4). L'invention concerne également un procédé de fabrication d'un composant électroluminescent (100).
(DE) Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements Es wird ein Licht emittierendes Bauelement(100) angegeben, das einen Licht emittierenden Halbleiterchip (1) mit einer Lichtauskoppelfläche (10), der lateral von einem ersten reflektierenden Material (2) formschlüssig umgeben ist,ein Folienelement (3) auf der Lichtauskoppelfläche (10) und ein optisches Element (4) auf dem Folienelement (3), das lateral von einem zweiten reflektierenden Material (5) formschlüssig umgeben ist,aufweist, wobei zumindest in einem Teilbereich ein gasgefüllter Spalt (6) zwischen dem Folienelement (3) und dem optischen Element (4) vorhanden ist. Weiterhin wird ein Verfahren zur Herstellung eines Licht emittierenden Bauelements (100) angegeben.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)