Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019048066) OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING AN OPTOELECTRONIC DECVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/048066 International Application No.: PCT/EP2017/072744
Publication Date: 14.03.2019 International Filing Date: 11.09.2017
IPC:
H01L 25/075 (2006.01) ,H01L 33/00 (2010.01) ,H01L 33/54 (2010.01) ,H01L 33/48 (2010.01) ,H01L 33/50 (2010.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
YEOH, Seng Hooi; MY
Agent:
PATENT ATTORNEYS WILHELM & BECK; Prinzenstr. 13 80639 Munich, DE
Priority Data:
Title (EN) OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING AN OPTOELECTRONIC DECVICE
(FR) DISPOSITIF OPTOÉLECTRONIQUE ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF OPTOÉLECTRONIQUE
(DE) OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING AN OPTOELECTRONIC DECVICE
Abstract:
(EN) An optoelectronic device (10) comprises a carrier (20) with a surface (21) wherein the surface (21) comprises a mounting area (22). The mounting area (22) is enclosed laterally by a retaining section (40) formed at the surface (21). At least one optoelectronic semiconductor chip (30) is arranged above the mounting area (22). An encapsulant (70) is arranged above the retaining section (40) and the mounting area (22), wherein the at least one optoelectronic semiconductor chip (30) is at least partially embedded in the encapsulant (70).
(FR) Dispositif optoélectronique (10) comprenant un support (20) ayant une surface (21), la surface (21) comprenant une zone de montage (22). La zone de montage (22) est délimitée latéralement par une section de retenue (40) formée au niveau de la surface (21). Au moins une puce semi-conductrice optoélectronique (30) est disposée au-dessus de la zone de montage (22). Un agent d'encapsulation (70) est disposé au-dessus de la section de retenue (40) et de la zone de montage (22), la ou les puces semi-conductrices optoélectroniques (30) étant au moins partiellement incorporées dans l'agent d'encapsulation (70).
(DE) 2017PF00757-17– SUMMARY OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING AN OPTOELECTRONIC DECVICE An optoelectronic devicecomprisesa carrier with a surface wherein the surfacecomprises a mounting area.The mounting areais enclosed laterally by a retaining section formed at the surface.At least one optoelectronic semiconductor chip is arranged above the mounting area. An encapsulantis ar- ranged above the retaining section and the mounting area, wherein the optoelectronic semiconductor chipis at least partially embedded in the encapsulant. (Figure4)
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)