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1. (WO2019047960) CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT, ELECTRONIC DEVICE, FORMING MOLD AND MANUFACTURING METHOD THEREOF
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Pub. No.: WO/2019/047960 International Application No.: PCT/CN2018/104915
Publication Date: 14.03.2019 International Filing Date: 11.09.2018
IPC:
H04N 5/225 (2006.01) ,B29C 45/26 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
17
Component parts, details or accessories; Auxiliary operations
26
Moulds
Applicants:
宁波舜宇光电信息有限公司 NINGBO SUNNY OPOTECH CO., LTD. [CN/CN]; 中国浙江省宁波市 余姚市舜宇路66-68号 66-68 Shunyu Road, Yuyao City Ningbo, Zhejiang 315400, CN
Inventors:
田中武彦 TANAKA, Takehiko; JP
黄桢 HUANG, Zhen; CN
赵波杰 ZHAO, Bojie; CN
梅哲文 MEI, Zhewen; CN
Agent:
宁波理文知识产权代理事务所(特殊普通合伙) NINGBO RAYMOND IP AGENCY FIRM; 中国浙江省宁波市 鄞州区首南街道日丽中路555号1903A室 Suite 1903A, 555 Rili Middle Road, Shounan Subdistrict, Yinzhou District Ningbo, Zhejiang 315100, CN
Priority Data:
201710810764.011.09.2017CN
201721159970.111.09.2017CN
Title (EN) CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT, ELECTRONIC DEVICE, FORMING MOLD AND MANUFACTURING METHOD THEREOF
(FR) MODULE DE CAMÉRA, ET COMPOSANT PHOTOSENSIBLE, DISPOSITIF ÉLECTRONIQUE, MOULE DE FORMATION ET SON PROCÉDÉ DE FABRICATION
(ZH) 摄像模组及其感光组件、电子设备、成型模具和制造方法
Abstract:
(EN) A camera module, and a photosensitive component and manufacturing method thereof, the photosensitive component comprising: a circuit board and a photosensitive element, as well as a molded base, the molded base being integrally formed on the circuit board and the photosensitive element, and forming an optical window providing a light path for the photosensitive element; for a portion of the molded base corresponding to a first end side of the molded base near a flexible region, a distance between an outer edge and an inner edge thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base distant from the flexible region, a distance between an outer edge and an inner edge thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to fill with mold material, preventing defective products from being formed because of a part not being able to fill with mold material.
(FR) L'invention concerne un module de caméra, et un composant photosensible et son procédé de fabrication, le composant photosensible comprenant : une carte de circuit imprimé et un élément photosensible, ainsi qu'une base moulée, la base moulée étant formée d'un seul tenant sur la carte de circuit imprimé et l'élément photosensible, et formant une fenêtre optique fournissant un trajet de lumière pour l'élément photosensible; pour une partie de la base moulée correspondant à un premier côté d'extrémité de la base moulée à proximité d'une région flexible, une distance entre un bord externe et un bord interne de celle-ci est a; pour une partie de la base moulée correspondant à un second côté d'extrémité opposé de la base moulée à distance de la région flexible, une distance entre un bord externe et un bord interne de celui-ci est c, 0,2 mm ≤a≤ 1 mm, et 0,2 mm ≤c≤ 15a. Les dimensions a et c permettent à une rainure de formation correspondante dans un processus de moulage de remplir le matériau de moule, empêchant ainsi la formation de produits défectueux du fait qu'une partie n'est pas capable de remplir le matériau de moule.
(ZH) 摄像模组及其感光组件和制造方法,该感光组件包括:电路板。感光元件,以及模塑基座,其中所述模塑基座一体地成型于所述电路板和所述感光元件并形成为所述感光元件提供光线通路的光窗;其中对应于所述模塑基座邻近所述柔性区域的第一端侧的所述模塑基座的部分,其外边缘与其内边缘之间的距离为a;对应于所述模塑基座远离所述柔性区域的相反的第二端侧的所述模塑基座的部分,其外边缘与其内边缘之间的距离为c,其中0.2mm≤a≤1mm,0.2mm≤c≤1.5a。其中a和c的尺寸使得模塑工艺中对应的成型槽中能够充满模塑材料,防止局部不能填充模塑材料而形成不良品。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)