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1. (WO2019047354) MANUFACTURING METHOD OF FLEXIBLE OLED PANEL, AND FLEXIBLE OLED PANEL
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Pub. No.: WO/2019/047354 International Application No.: PCT/CN2017/108861
Publication Date: 14.03.2019 International Filing Date: 01.11.2017
IPC:
H01L 51/56 (2006.01) ,H01L 51/00 (2006.01) ,H01L 27/12 (2006.01) ,H01L 27/32 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02
including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12
the substrate being other than a semiconductor body, e.g. an insulating body
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
Applicants:
武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN/CN]; 中国湖北省武汉市 东湖新技术开发区高新大道666号光谷生物创新园C5栋305室 305 Room, Building C5 Biolake of Optics Valley, No.666 Gaoxin Avenue, Wuhan East Lake High-tech Development Zone Wuhan, Hubei 430079, CN
Inventors:
张鹏振 ZHANNG, Pengzhen; CN
Agent:
深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY; 中国广东省深圳市 福田区深南大道6021号喜年中心A座1709-1711 Hailrun Complex Block A Room 1709-1711 No.6021 Shennan Blvd., Futian District Shenzhen, Guangdong 518040, CN
Priority Data:
201710793594.X06.09.2017CN
Title (EN) MANUFACTURING METHOD OF FLEXIBLE OLED PANEL, AND FLEXIBLE OLED PANEL
(FR) PROCÉDÉ DE FABRICATION DE PANNEAU DELO, ET PANNEAU DELO SOUPLE
(ZH) 柔性 OLED 面板的制作方法及柔性 OLED 面板
Abstract:
(EN) A manufacturing method of a flexible OLED panel, and flexible OLED panel. The method comprises: providing an organic material substrate (10); depositing a metal protective layer on the organic material substrate (11); depositing, by means of a high-temperature plasma-enhanced chemical vapor deposition process, a buffer layer on the metal protective layer (12); and forming a semiconductor layer on the buffer layer (13). The metal protective layer is used to prevent a fabrication process of a buffer layer from contaminating a plasma-enhanced chemical vapor deposition cavity and pipes.
(FR) La présente invention porte sur un procédé de fabrication d'un panneau DELO souple, et sur un panneau DELO souple. Le procédé consiste : à fournir un substrat de matériau organique (10); à déposer une couche de protection métallique sur le substrat de matériau organique (11); à déposer, au moyen d'un procédé de dépôt chimique en phase vapeur activé par plasma à haute température, une couche tampon sur la couche de protection métallique (12); et à former une couche semi-conductrice sur la couche tampon (13). La couche de protection métallique est destinée à empêcher la contamination de tuyaux et d'une cavité de dépôt chimique en phase vapeur activé par plasma par un processus de fabrication d'une couche tampon.
(ZH) 一种柔性OLED面板的制作方法及柔性OLED面板,包括:提供一有机材料基板(10);在有机材料基板上沉积金属保护层(11);在金属保护层上采用高温等离子增强化学气相沉积工艺沉积缓冲层(12);在缓冲层上形成半导体层(13);金属保护层用于防止缓冲层制程对等离子增强化学气相沉积腔体和管道的污染。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)