Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019047086) PLATING CHUCK
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/047086 International Application No.: PCT/CN2017/100814
Publication Date: 14.03.2019 International Filing Date: 07.09.2017
IPC:
C25D 7/12 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
12
Semiconductors
Applicants:
ACM RESEARCH (SHANGHAI) INC. [CN/CN]; Bld. 4, No. 1690 Cailun Road Zhangjiang High-Tech Park Shanghai 201203, CN
Inventors:
WANG, Hui; CN
WANG, Jian; CN
JIA, Zhaowei; CN
YANG, Hongchao; CN
Agent:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road Shanghai 200233, CN
Priority Data:
Title (EN) PLATING CHUCK
(FR) MANDRIN DE PLACAGE
Abstract:
(EN) A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.
(FR) L'invention concerne un mandrin de placage permettant de maintenir un substrat au cours de processus de placage, le substrat comportant une zone d'encoche (3031) et une région à motifs (3032) adjacente à la zone d'encoche (3031). Le mandrin de placage comprend une plaque de recouvrement (3033) conçue pour recouvrir la zone d'encoche (3031) du substrat pour protéger le champ électrique au niveau de la zone d'encoche (3031) lorsque le substrat est plaqué.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)