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1. (WO2019047054) CT DETECTOR MODULE AND HEAT DISSIPATION STRUCTURE
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Pub. No.: WO/2019/047054 International Application No.: PCT/CN2017/100659
Publication Date: 14.03.2019 International Filing Date: 06.09.2017
IPC:
A61B 6/03 (2006.01)
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
6
Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
02
Devices for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
03
Computerised tomographs
Applicants:
SHENZHEN UNITED IMAGING HEALTHCARE CO., LTD. [CN/CN]; Room 202-207, Building C, No. 1 Chuangye Building, No. 6 Industrial Rd, Nanshan District Shenzhen, Guangdong 518067, CN
Inventors:
YE, Ting; CN
Agent:
METIS IP (CHENGDU) LLC; (No. 846 South Tianfu Road) Tianfu Innovation Center Chengdu, Sichuan 610213, CN
Priority Data:
Title (EN) CT DETECTOR MODULE AND HEAT DISSIPATION STRUCTURE
(FR) MODULE DÉTECTEUR DE TOMODENSITOMÉTRIE ET STRUCTURE DE DISSIPATION THERMIQUE
Abstract:
(EN) A detector module (208, 300, 400, 800, 900, 1000) is provided. The detector module (208, 300, 400, 800, 900, 1000) may include a plurality of detector sub-modules (350a, 350b, 350c, 450a, 450b, 450c, 500, 600, 850d, 950a, 950c, 1050a, 1050b, 1050b’, 1050c, 1100, 1200, 1300). Each of the plurality of detector sub-modules (350a, 350b, 350c, 450a, 450b, 450c, 500, 600, 850d, 950a, 950c, 1050a, 1050b, 1050b’, 1050c, 1100, 1200, 1300) may include a detection layer (406, 506, 606, 706, 1206, 1306), at least one data acquisition circuitry (303, 503, 703, 803, 903, 1003, 1103, 1203, 1303a, 1303b), a frame (304, 404, 504, 604, 804, 904, 1004, 1104, 1204, 1304) for supporting the detection layer (406, 506, 606, 706, 1206, 1306), and a positioning element for assembling the plurality of detector sub-modules (350a, 350b, 350c, 450a, 450b, 450c, 500, 600, 850d, 950a, 950c, 1050a, 1050b, 1050b’, 1050c, 1100, 1200, 1300). The frame (304, 404, 504, 604, 804, 904, 1004, 1104, 1204, 1304) may include a plurality of heat transfer fins (405, 505, 605, 815, 905, 1005, 1105, 1205, 1305a, 1305b) that are thermally connected with the at least one data acquisition circuitry (303, 503, 703, 803, 903, 1003, 1103, 1203, 1303a, 1303b) for dissipating heat produced by the at least one data acquisition circuitry (303, 503, 703, 803, 903, 1003, 1103, 1203, 1303a, 1303b).
(FR) L'invention concerne un module détecteur (208, 300, 400, 800, 900, 1000). Le module détecteur (208, 300, 400, 800, 900, 1000) peut comprendre une pluralité de sous-modules détecteurs (350a, 350b, 350c, 450a, 450b, 450c, 500, 600, 850d, 950a, 950c, 1050a, 1050b, 1050b', 1050c, 1100, 1200, 1300). Chacun de la pluralité de sous-modules détecteurs (350a, 350b, 350c, 450a, 450b, 450c, 500, 600, 850d, 950a, 950c, 1050a, 1050b, 1050b', 1050c, 1100, 1200, 1300) peut comprendre une couche de détection (406, 506, 606, 706, 1206, 1306), au moins un ensemble de circuits d'acquisition de données (303, 503, 703, 803, 903, 1003, 1103, 1203, 1303a, 1303b), un cadre (304, 404, 504, 604, 804, 904, 1004, 1104, 1204, 1304) pour supporter la couche de détection (406, 506, 606, 706, 1206, 1306) et un élément de positionnement pour assembler la pluralité de sous-modules détecteurs (350a, 350b, 350c, 450a, 450b, 450c, 500, 600, 850d, 950a, 950c, 1050a, 1050b, 1050b', 1050c, 1100, 1200, 1300). Le cadre (304, 404, 504, 604, 804, 904, 1004, 1104, 1204, 1304) peut comprendre une pluralité d'ailettes de transfert de chaleur (405, 505, 605, 815, 905, 1005, 1105, 1205, 1305a, 1305b) en liaison thermique avec l'au moins un ensemble de circuits d'acquisition de données (303, 503, 703, 803, 903, 1003, 1103, 1203, 1303a, 1303b) afin de dissiper la chaleur produite par l'au moins un ensemble de circuits d'acquisition de données (303, 503, 703, 803, 903, 1003, 1103, 1203, 1303a, 1303b).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)