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1. (WO2019046630) SEMICONDUCTOR DEVICES, TRANSISTORS, AND RELATED METHODS FOR CONTACTING METAL OXIDE SEMICONDUCTOR DEVICES
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Pub. No.: WO/2019/046630 International Application No.: PCT/US2018/048936
Publication Date: 07.03.2019 International Filing Date: 30.08.2018
IPC:
H01L 29/786 (2006.01) ,H01L 29/66 (2006.01) ,H01L 27/105 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
68
controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified, or switched
76
Unipolar devices
772
Field-effect transistors
78
with field effect produced by an insulated gate
786
Thin-film transistors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02
including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04
the substrate being a semiconductor body
10
including a plurality of individual components in a repetitive configuration
105
including field-effect components
Applicants:
MICRON TECHNOLOGY, INC. [US/US]; 8000 South Federal Way Mailstop 1-507 Boise, Idaho 83707, US
Inventors:
RAMASWAMY, Durai Vishak Nirmal; US
GANDHI, Ramanathan; US
SILLS, Scott E.; US
Agent:
GUTKE, Steven W.; US
BACA, Andrew J.; US
ZIEGLER, Bailey M.; US
BEZDJIAN, Daniel J.; US
BAKER, Gregory C.; US
FLORES, Jesse M.; US
GUNN, J. Jeffrey; US
HAMER, Katherine A.; US
SCHIERMAN, Elizabeth Herbst; US
WALKOWSKI, Joseph A.; US
WHITLOCK, Nathan E.; US
WATSON, James C.; US
WOODHOUSE, Kyle M.; US
Priority Data:
16/118,06430.08.2018US
62/552,80931.08.2017US
Title (EN) SEMICONDUCTOR DEVICES, TRANSISTORS, AND RELATED METHODS FOR CONTACTING METAL OXIDE SEMICONDUCTOR DEVICES
(FR) DISPOSITIFS À SEMI-CONDUCTEUR, TRANSISTORS ET PROCÉDÉS ASSOCIÉS POUR METTRE EN CONTACT DES DISPOSITIFS À SEMI-CONDUCTEUR À OXYDE MÉTALLIQUE
Abstract:
(EN) A semiconductor device is disclosed. The semiconductor device includes a transistor including a source contact, a drain contact, and a channel region including an oxide semiconductor material as the channel material. At least one of the drain contact or the source contact include a conductive material, such as Ruthenium, to reduce the Schottky effects at the interface with the channel material.
(FR) La présente invention concerne un dispositif à semi-conducteur. Le dispositif à semi-conducteur comprend un transistor comprenant un contact de source, un contact de drain et une région de canal comprenant un matériau semi-conducteur à oxyde en tant que matériau de canal. Au moins l'un parmi le contact de drain ou le contact de source comprend un matériau conducteur, tel que le ruthénium, pour réduire les effets de Schottky à l'interface avec le matériau de canal.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)