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1. (WO2019046471) TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
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Pub. No.: WO/2019/046471 International Application No.: PCT/US2018/048616
Publication Date: 07.03.2019 International Filing Date: 29.08.2018
IPC:
H01L 21/67 (2006.01) ,H01L 21/683 (2006.01) ,H05K 13/02 (2006.01) ,B65D 73/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
02
Feeding of components
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
D
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
73
Packages comprising articles attached to cards, sheets, or webs
02
Articles, e.g. small electrical components, attached to webs
Applicants:
DAEWON SEMICONDUCTOR PACKAGING INDUSTRIAL COMPANY [US/US]; 2350 Mission College Blvd., Suite 900 Santa Clara, CA 95054, US
Inventors:
CHANG, Sunna; US
KIM, John; US
PARK, Ryan; US
KWON, Denny; US
WHITLOCK, Matthew; US
OKOREN, Athens; US
Agent:
COLEMAN, Brian; US
Priority Data:
62/551,75829.08.2017US
Title (EN) TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
(FR) ENSEMBLES BANDES DE TRANSPORT COMPORTANT UN FILM ADHÉSIF INTÉGRÉ
Abstract:
(EN) Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
(FR) L'invention concerne des ensembles bandes de transport qui permettent d'améliorer le rendement et de réduire les coûts lorsqu'ils sont utilisés dans la manipulation, le transport ou le stockage de composants semi-conducteurs. Un ensemble bande de transport peut comprendre un film adhésif apposé à une bande de transport allongée. Par exemple, le film adhésif peut être stratifié d'une seule pièce sur la surface supérieure de la bande de transport allongée sous la forme d'une feuille continue unique (c'est-à-dire, ininterrompue). Le film adhésif peut se conformer sensiblement à la surface supérieure de la bande de transport allongée, notamment à toutes cavités perforées destinées à contenir des composants semi-conducteurs. La fixation appropriée des composants semi-conducteurs à l'ensemble bande de transport dépend de la propriété adhésive du ou des matériaux constituant le film adhésif.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)