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1. (WO2019046331) MODULE MOUNT INTERPOSER
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Pub. No.: WO/2019/046331 International Application No.: PCT/US2018/048389
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
H05K 3/34 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
FINISAR CORPORATION [US/US]; 1389 Moffett Park Drive Sunnyvale, CA 94089, US
Inventors:
LIAN, Jia; US
PENG, Huaping; US
SHI, Shamei; US
WANG, William, H.; US
FLENS, Frank, J.; US
VERGEEST, Henricus Jozef; US
Agent:
MASCHOFF, Eric, L.; US
BRAITHWAITE, Jared, J.; US
BENNS, Jonathan, M.; US
ATZET, Ian, A.; US
BARBER, Daniel, R.; US
Priority Data:
15/688,40228.08.2017US
Title (EN) MODULE MOUNT INTERPOSER
(FR) INTERPOSEUR DE MONTAGE DE MODULE
Abstract:
(EN) A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
(FR) L'invention concerne un interposeur de montage de module, pouvant comprendre un ou plusieurs récepteurs de fixation configurés pour être accouplés mécaniquement à un ou plusieurs éléments de fixation de façon à accoupler mécaniquement et électriquement un module à l'interposeur. L'interposeur de montage de module peut également comprendre un noyau configuré pour être accouplé électriquement au module, chacun des récepteurs de fixation étant mécaniquement accouplé au noyau. L'interposeur de montage de module peut en outre comprendre une couche de brasure accouplée électriquement au noyau et configurée pour être accouplée électriquement à une carte de circuit imprimé (PCB) de façon à fournir un signal électrique du module à la PCB et à fournir un signal électrique de la PCB au module.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)