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1. (WO2019046054) ESC SUBSTRATE SUPPORT WITH CHUCKING FORCE CONTROL
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Pub. No.: WO/2019/046054 International Application No.: PCT/US2018/047447
Publication Date: 07.03.2019 International Filing Date: 22.08.2018
IPC:
H01L 21/683 (2006.01) ,H02N 13/00 (2006.01) ,H01L 21/67 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
N
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
13
Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
BOYD, JR., Wendell Glenn; US
HE, Jim Zhongyi; US
DING, Zhenwen; US
Agent:
PATTERSON, B. Todd; US
TABOADA, Keith; US
Priority Data:
62/551,74729.08.2017US
Title (EN) ESC SUBSTRATE SUPPORT WITH CHUCKING FORCE CONTROL
(FR) SUPPORT DE PORTE-SUBSTRAT ÉLECTROSTATIQUE AVEC COMMANDE DE FORCE DE SERRAGE
Abstract:
(EN) Embodiments described herein provide methods and apparatus used to reduce or substantially eliminate undesirable scratches to the non-active surface of a substrate by monitoring and controlling the deflection of a substrate, and thus the contact force between the substrate and a substrate support, during substrate processing. In one embodiment a method for processing a substrate includes positioning the substrate on a patterned surface of a substrate support, where the substrate support is disposed in a processing volume of a processing chamber, applying a chucking voltage to a chucking electrode disposed in the substrate support; flowing a gas into a backside volume disposed between the substrate and the substrate support, monitoring a deflection of the substrate, and changing a chucking parameter based on the deflection of the substrate.
(FR) Des modes de réalisation de la présente invention concernent des procédés et un appareil utilisés pour réduire ou éliminer sensiblement des rayures indésirables sur la surface non active d'un substrat par surveillance et commande de la déviation d'un substrat, et ainsi la force de contact entre le substrat et un support de substrat, pendant le traitement du substrat. Dans un mode de réalisation, un procédé de traitement d'un substrat comprend le positionnement du substrat sur une surface à motifs d'un support de substrat, le support de substrat étant disposé dans un volume de traitement d'une chambre de traitement, l'application d'une tension de serrage à une électrode de serrage disposée dans le support de substrat ; l'écoulement d'un gaz dans un volume arrière disposé entre le substrat et le support de substrat, la surveillance d'une déviation du substrat, et le changement d'un paramètre de serrage sur la base de la déviation du substrat.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)