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1. (WO2019045936) TWO-STEP PROCESS FOR FORMING CURED POLYMERIC FILMS FOR ELECTRONIC DEVICE ENCAPSULATION
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Pub. No.: WO/2019/045936 International Application No.: PCT/US2018/044529
Publication Date: 07.03.2019 International Filing Date: 31.07.2018
IPC:
B44C 1/17 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
44
DECORATIVE ARTS
C
PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
1
Processes, not specifically provided for elsewhere, for producing decorative surface effects
16
for applying transfer pictures or the like
165
for decalcomanias; Sheet materials therefor
17
Dry transfer
Applicants:
KATEEVA, INC. [US/US]; 7015 Gateway Boulevard Newark, California 94560, US
Inventors:
LASSITER, Brian E.; US
MORO, Lorenza; US
RAMOS, Teresa A.; US
TAI, Elizabeth; US
SERRATO, Alonso; US
STEINMANN, Vera; US
Agent:
TOSTADO, Paula; US
MANNING, Michelle; US
Priority Data:
62/553,63301.09.2017US
Title (EN) TWO-STEP PROCESS FOR FORMING CURED POLYMERIC FILMS FOR ELECTRONIC DEVICE ENCAPSULATION
(FR) PROCÉDÉ EN DEUX ÉTAPES POUR FORMER DES FILMS POLYMÈRES DURCIS POUR L'ENCAPSULATION DE DISPOSITIFS ÉLECTRONIQUES
Abstract:
(EN) Methods for increasing the degree of curing and/or reducing the volatile photoinitiator concentration in cured polymeric film, and particularly in cured polymeric films in a multilayered thin film encapsulation stack are provided. Also provided are highly crosslinked and/or low-outgassing thin polymeric films and encapsulation stacks made using the methods.
(FR) Cette invention concerne des procédés d'augmentation du degré de durcissement et/ou de réduction de la concentration en photo-initiateur volatil dans un film polymère durci, et en particulier dans des films polymères durcis dans un empilement d'encapsulation de films minces multicouches. L'invention concerne en outre des films polymères minces hautement réticulés et/ou à faible dégagement de gaz et des empilements d'encapsulation fabriquées à l'aide desdits procédés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)